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TLV3701CDBVT

Texas Instruments

TLV3701CDBVT by Texas Instruments

TLV3701CDBVT by Texas Instruments is a CMOS comparator with 7000uV max input offset voltage, 0.0015uA max average bias current, and 240000ns nominal response time. Ideal for applications requiring precise voltage comparisons in commercial temperature environments.

Median Price

$1.930

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

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Chip1Stop

Japan . 469 parts In-Stock

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$2.890

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Mouser Electronics

USA . 517 parts In-Stock

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$0.971

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$0.905

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Nova Conductors

Japan . 550 parts In-Stock

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$0.965

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Vyrian

USA . 8,073 parts In-Stock

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Chip Stock

USA . 5,550 parts In-Stock

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Digiode

USA . 4,636 parts In-Stock

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Bristol Electronics

USA . 500 parts In-Stock

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Dan-Mar Components

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Semicontronic

India . 72 parts In-Stock

1+ parts

$0.830

100+ parts

$0.809

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$0.805

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72

$0.830

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$0.805

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Ampacity Inc.

Singapore . 18 parts In-Stock

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$0.830

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Continental Prestige Electronics

USA . 5,719 parts In-Stock

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$0.965

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Argo Parts USA

USA . 4,004 parts In-Stock

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Netroflash

USA . 2,000 parts In-Stock

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Advanced Electronics

New Zealand . 350 parts In-Stock

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Corohmni

South Africa . 820 parts In-Stock

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$1.043

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Parana Technologies

USA . 599 parts In-Stock

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$4.187

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$388.868

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$3.769

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DigiPath Technology Company

USA . 636 parts In-Stock

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$4.611

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$4.242

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636

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ChromeModa Solutions

Germany . 5,897 parts In-Stock

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$4.705

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$3.858

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IDEA Electronic Components Group

UK . 747 parts In-Stock

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$4.234

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Microchip USA

USA . 317 parts In-Stock

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$5.210

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$5.190

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$5.170

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AZTECH Wire

Italy . 501 parts In-Stock

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Perfect Parts

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Lixinc

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Corphita

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Kepictronics

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ChipstoGo Electronic ltd

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Overview

Unlock precision and reliability with the TLV3701CDBVT by Texas Instruments. As a leader in the industry, Texas Instruments delivers unparalleled quality and innovation in every product they create. The TLV3701CDBVT is a game-changer in the field of comparators, offering fast response times and low power consumption for a wide range of applications. Trust in Texas Instruments to provide cutting-edge technology that exceeds expectations and revolutionizes your projects. Elevate your designs with the TLV3701CDBVT today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material makes the comparator lightweight and durable, making it suitable for a variety of applications.

Maximum Input Offset Voltage: 7000 uV

The high maximum input offset voltage allows for precise comparisons, ensuring accurate results in various circuit configurations.

Surface Mount: YES

The surface mount capability allows for easy and efficient PCB assembly, saving time and effort during production.

Nominal Supply Voltage / Vsup (V): 2.7

The nominal supply voltage of 2.7V provides a stable power source for the comparator to operate efficiently.

Output Type: PUSH-PULL

The push-pull output type ensures strong and reliable signal output, making this comparator suitable for driving various loads.

Technology: CMOS

The CMOS technology used in this comparator results in low power consumption, making it energy-efficient and suitable for battery-powered devices.

Technical Specifications

Comparators TLV3701CDBVT attributes and parameters. Explore more Comparators devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Technology:

CMOS

Power Supply:

±1.25/±8/2.5/16 V

Total Functions:

1

Sub-Category:

Comparators

Output Type:

Push-Pull

Performance Specifications

Maximum Input Offset Voltage:

7 mV

Peak Bias Current:

1.5 nA

Maximum Bias Current (IIB) @25 °C:

100 pA

Operational Characteristics

Maximum Supply Current:

800 nA

Nominal Supply Voltage:

2.7 V

Maximum Supply Voltage:

17 V

Nominal Negative Supply Voltage (Vsup):

0 V

Maximum Negative Supply Voltage:

0 V

Lowest Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Nominal Response Time:

240 µs

Physical Characteristics

Length:

0.114 in (2.9 mm)

Width:

0.063 in (1.6 mm)

Maximum Seated Height:

0.057 in (1.45 mm)

Total Terminals:

5

Terminal Pitch:

0.037 in (0.95 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel/Palladium/Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

Package Shape:

Package Type:

Small Outline, Low Profile, Shrink Pitch

Package Equivalence Code:

TSOP5/6,.11,37

Trade Compliance

TLV3701CDBVT Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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