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TLC34074-170FN

Texas Instruments

TLC34074-170FN by Texas Instruments

TLC34074-170FN by Texas Instruments is an 8-bit D/A converter with 0.39% linearity error, settling time of 0.006 us, and operates at 5V. It is used in commercial applications for precise voltage conversion in a square chip carrier package.

Median Price

$18.720

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 15 parts In-Stock

1+ parts

$18.720

100+ parts

-

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15

$18.720

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Vyrian

USA . 6,035 parts In-Stock

1+ parts

-

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6,035

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Digiode

USA . 296 parts In-Stock

1+ parts

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296

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Lakeland Logistics Inc

USA . 15 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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15

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Mentor Electronics Marketing, LLC

USA . 15 parts In-Stock

1+ parts

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15

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ECAB

Sweden . 1 parts In-Stock

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1

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 285 parts In-Stock

1+ parts

$14.000

100+ parts

-

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285

$14.000

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AZTECH Wire

Italy . 396 parts In-Stock

1+ parts

$14.632

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396

$14.632

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Parana Technologies

USA . 1,550 parts In-Stock

1+ parts

$17.283

100+ parts

-

1k+ parts

$17.497

10k+ parts

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1,550

$17.283

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$17.497

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DigiPath Technology Company

USA . 365 parts In-Stock

1+ parts

$19.031

100+ parts

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365

$19.031

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ChromeModa Solutions

Germany . 4,337 parts In-Stock

1+ parts

$19.419

100+ parts

$15.924

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4,337

$19.419

$15.924

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IDEA Electronic Components Group

UK . 1,703 parts In-Stock

1+ parts

$19.419

100+ parts

$18.448

1k+ parts

$17.477

10k+ parts

-

1,703

$19.419

$18.448

$17.477

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Corphita

USA . 533 parts In-Stock

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533

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Assy Fe

Spain . 40 parts In-Stock

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40

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Overview

Unlock a world of possibilities with the TLC34074-170FN by Texas Instruments. Crafted with precision and expertise, this product is designed to deliver exceptional performance in a wide range of applications. Whether you're looking to enhance your audio systems or improve signal processing, the TLC34074-170FN offers unparalleled quality and reliability. Trust in Texas Instruments to provide you with cutting-edge solutions that bring value, efficiency, and innovation to your projects. Experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, making the product suitable for various applications without adding unnecessary weight.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and reducing production costs.

No. of Bits: 8

With 8 bits, this converter provides sufficient resolution for accurate analog-to-digital conversions in a wide range of applications.

Maximum Settling Time: 0.006 us

The fast settling time ensures quick and accurate conversion results, making this product ideal for time-sensitive applications.

Power Supplies (V): 5

Operating at 5V, this converter can easily interface with standard power supplies, providing compatibility and ease of use.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of digital systems, making this product energy-efficient and versatile.

Nominal Supply Voltage: 5 V

Operating at a nominal voltage of 5V, this converter is well-suited for standard voltage applications, ensuring compatibility and ease of integration.

Technical Specifications

Other Function Converters TLC34074-170FN attributes and parameters. Explore more Other Function Converters devices from Texas Instruments

Converter Specifications

Converter Type:

Technology:

CMOS

No. of Bits:

8

No. of Functions:

1

Maximum Linearity Error (EL):

0.39 %

Maximum Settling Time:

6 ns

Electrical Specifications

Nominal Supply Voltage:

5 V

Operating Conditions

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Temperature Grade:

Form Factor

No. of Terminals:

84

Terminal Form:

Terminal Position:

Quad

Terminal Pitch:

0.05 in (1.27 mm)

Surface Mount:

Yes

Packaging

Package Shape:

Package Body Material:

Plastic/Epoxy

Package Code:

Package Style:

Chip Carrier

Package Equivalence Code:

LDCC84,1.2SQ

Standards and Codes

Qualified:

No

JESD-30 Code:

S-PQCC-J84

Trade Compliance

TLC34074-170FN Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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