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TLC34076-66FN

Texas Instruments

TLC34076-66FN by Texas Instruments

TLC34076-66FN by Texas Instruments is an 8-bit D/A converter with 0.39% linearity error, settling time of 0.008 us, and operates on 5V. It comes in a square chip carrier package with 84 terminals and is ideal for commercial applications requiring precise analog signal conversion.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,823 parts In-Stock

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Digiode

USA . 718 parts In-Stock

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718

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,243 parts In-Stock

1+ parts

$15.219

100+ parts

-

1k+ parts

$15.616

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1,243

$15.219

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$15.616

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DigiPath Technology Company

USA . 1,474 parts In-Stock

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$16.758

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1,474

$16.758

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IDEA Electronic Components Group

UK . 665 parts In-Stock

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$17.100

100+ parts

$16.245

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$15.390

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665

$17.100

$16.245

$15.390

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ChromeModa Solutions

Germany . 38 parts In-Stock

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$17.100

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$14.022

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38

$17.100

$14.022

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AZTECH Wire

Italy . 749 parts In-Stock

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$18.382

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749

$18.382

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One Stop Electronics

USA . 1,201 parts In-Stock

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$32.000

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1,201

$32.000

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Corphita

USA . 2,965 parts In-Stock

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Overview

Unlock the potential of your electronic designs with the TLC34076-66FN from Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality products that are built to last. This versatile D/A converter offers 3 functions in one convenient package, making it perfect for a wide range of applications. With a quick settling time and minimal linearity error, this converter ensures precise and accurate results every time. Trust Texas Instruments to provide you with the tools you need to bring your projects to life.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body makes the product lightweight and durable, ensuring it can withstand various environmental conditions.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation of the converter onto a circuit board, saving space and making assembly quicker.

No. of Functions: 3

Having multiple functions in one converter increases its versatility and functionality, enabling it to perform different tasks efficiently.

Package Shape: SQUARE

The square package shape provides a compact design, allowing the converter to fit into tight spaces on a circuit board and maximizing space efficiency.

Maximum Settling Time: 0.008 us

The fast settling time ensures that the converter quickly reaches a stable output voltage, reducing the time needed for data conversion and improving overall performance.

Maximum Linearity Error (EL): 0.39 %

The low linearity error ensures accurate and precise conversion of analog signals, making the converter reliable for applications that require high precision.

Power Supplies (V): 5

Operating at a standard supply voltage of 5V makes the converter compatible with a wide range of electronic systems and easy to integrate into existing designs.

No. of Terminals: 84

Having a high number of terminals provides flexibility in connecting the converter to other components, allowing for customization and versatility in circuit designs.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers efficient heat dissipation and protection for the internal components of the converter, ensuring reliability and longevity.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature allows the converter to function reliably in various environments and conditions without overheating or failing.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures that the converter can start up and operate effectively even in cold environments, making it versatile for different applications.

Terminal Position: QUAD

The quad terminal position simplifies the installation and connectivity of the converter, making it easy to integrate into circuit boards and reducing the risk of connection errors.

Technology: CMOS

The CMOS technology used in the converter offers low power consumption, high speed, and compatibility with a wide range of devices, making it an efficient and reliable choice.

Terminal Form: J BEND

The J bend terminal form ensures secure and reliable connections, reducing the risk of disconnection or signal loss, and making installation and maintenance easier.

Converter Type: D/A CONVERTER

Being a digital-to-analog converter allows the product to convert digital signals into analog output with precision and accuracy, making it suitable for a wide range of applications.

Nominal Supply Voltage: 5 V

Having a nominal supply voltage of 5V ensures compatibility with standard power sources and makes the converter easy to integrate into existing systems without the need for additional power supplies.

Terminal Pitch: 1.27 mm

The small terminal pitch of 1.27mm allows for high-density mounting of the converter on a circuit board, saving space and enabling more compact device designs.

Technical Specifications

Other Function Converters TLC34076-66FN attributes and parameters. Explore more Other Function Converters devices from Texas Instruments

Converter Specifications

Converter Type:

Technology:

CMOS

No. of Bits:

8

No. of Functions:

3

Maximum Linearity Error (EL):

0.39 %

Maximum Settling Time:

8 ns

Electrical Specifications

Nominal Supply Voltage:

5 V

Operating Conditions

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Temperature Grade:

Form Factor

No. of Terminals:

84

Terminal Form:

Terminal Position:

Quad

Terminal Pitch:

0.05 in (1.27 mm)

Surface Mount:

Yes

Packaging

Package Shape:

Package Body Material:

Plastic/Epoxy

Package Code:

Package Style:

Chip Carrier

Package Equivalence Code:

LDCC84,1.2SQ

Standards and Codes

Qualified:

No

JESD-30 Code:

S-PQCC-J84

Trade Compliance

TLC34076-66FN Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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