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TLC34075-85

Texas Instruments

TLC34075-85 by Texas Instruments

TLC34075-85 by Texas Instruments is an 8-bit D/A converter with 0.39% EL, suitable for commercial applications. It operates at 0-70°C, powered by 5V supply, in a square chip carrier package with 84 terminals. This CMOS technology device offers high linearity and precision for various function conversion needs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,362 parts In-Stock

1+ parts

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8,362

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Digiode

USA . 4,210 parts In-Stock

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4,210

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,033 parts In-Stock

1+ parts

$4.497

100+ parts

-

1k+ parts

$4.938

10k+ parts

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2,033

$4.497

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$4.938

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DigiPath Technology Company

USA . 550 parts In-Stock

1+ parts

$4.952

100+ parts

$4.556

1k+ parts

-

10k+ parts

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550

$4.952

$4.556

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ChromeModa Solutions

Germany . 3,943 parts In-Stock

1+ parts

$5.053

100+ parts

$4.143

1k+ parts

-

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3,943

$5.053

$4.143

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IDEA Electronic Components Group

UK . 614 parts In-Stock

1+ parts

$5.053

100+ parts

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1k+ parts

$4.548

10k+ parts

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614

$5.053

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$4.548

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AZTECH Wire

Italy . 664 parts In-Stock

1+ parts

$5.687

100+ parts

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664

$5.687

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One Stop Electronics

USA . 437 parts In-Stock

1+ parts

$22.000

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437

$22.000

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Corphita

USA . 3,168 parts In-Stock

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3,168

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Overview

Elevate your electronic designs with the TLC34075-85 from Texas Instruments. As a trusted manufacturer in the industry, Texas Instruments delivers top-quality products like this 8-bit D/A converter that offers precision and reliability. Ideal for a range of applications, this chip carrier style converter boasts three functions and a low linearity error of just 0.39%. With a wide operating temperature range and commercial-grade technology, the TLC34075-85 is the perfect choice for your next project. Experience the value and benefits of Texas Instruments with this versatile and high-performance converter.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the converter easy to handle and resistant to damage.

Surface Mount: YES

The surface mount design allows for easy and secure installation on PCBs, saving space and reducing assembly time.

No. of Functions: 3

Having multiple functions in one converter increases its versatility and efficiency in various applications.

Package Shape: SQUARE

The square shape allows for better integration into circuit layouts and enhances connectivity with other components.

Maximum Linearity Error (EL): 0.39%

This low linearity error ensures accurate and reliable conversion of analog to digital signals, making the converter highly precise.

Power Supplies (V): 5

Operating at 5V allows for compatibility with standard power sources, making integration into existing systems easier.

No. of Terminals: 84

Having a higher number of terminals provides more connection options, enabling versatile usage in complex circuit designs.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers enhanced thermal performance, compact size, and secure mounting, ideal for modern electronic applications.

Maximum Operating Temperature: 70 °C

Operational up to 70°C ensures reliability in high-temperature environments, expanding the range of applications this converter can be used in.

Minimum Operating Temperature: 0 °C

With a minimum operating temperature of 0°C, this converter can function in varying temperature conditions, ensuring consistent performance.

Terminal Position: QUAD

Quad terminal positioning facilitates efficient connectivity and soldering, enhancing the ease of installation and maintenance of the converter.

Temperature Grade: COMMERCIAL

Designed for commercial applications, this converter meets industry standards for performance and reliability in mainstream electronic devices.

Technology: CMOS

Using CMOS technology ensures low power consumption, high noise immunity, and compatibility with a wide range of devices, making the converter energy-efficient and versatile.

Terminal Form: J BEND

J bend terminal form simplifies soldering and PCB mounting processes, improving the reliability and longevity of the converter in electronic assemblies.

Converter Type: D/A CONVERTER

As a digital-to-analog converter, this product enables the conversion of digital signals into analog outputs, crucial for various signal processing applications.

Nominal Supply Voltage: 5 V

Operating at a standard supply voltage of 5V ensures compatibility with common power sources, making integration into existing systems straightforward.

Terminal Pitch: 1.27 mm

The terminal pitch of 1.27mm allows for precise alignment and connection with other components on the PCB, enhancing the overall reliability and performance of the converter.

Technical Specifications

Other Function Converters TLC34075-85 attributes and parameters. Explore more Other Function Converters devices from Texas Instruments

Converter Specifications

Converter Type:

Technology:

CMOS

No. of Bits:

8

No. of Functions:

3

Maximum Linearity Error (EL):

0.39 %

Electrical Specifications

Nominal Supply Voltage:

5 V

Operating Conditions

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Temperature Grade:

Form Factor

No. of Terminals:

84

Terminal Form:

Terminal Position:

Quad

Terminal Pitch:

0.05 in (1.27 mm)

Surface Mount:

Yes

Packaging

Package Shape:

Package Body Material:

Plastic/Epoxy

Package Code:

Package Style:

Chip Carrier

Package Equivalence Code:

LDCC84,1.2SQ

Standards and Codes

Qualified:

No

JESD-30 Code:

S-PQCC-J84

Trade Compliance

TLC34075-85 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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