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TLC339CNS

Texas Instruments

TLC339CNS by Texas Instruments

TLC339CNS by Texas Instruments is a CMOS comparator with 4 functions, Vsup of 5V, and IIB of 0.0006uA. It has a response time of 2500ns and operates b/w 0-70°C. Ideal for applications requiring open-drain output in commercial-grade environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

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Digiode

USA . 1,982 parts In-Stock

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One Stop Electronics

USA . 1,603 parts In-Stock

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$2.410

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Parana Technologies

USA . 1,566 parts In-Stock

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$6.068

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$6.846

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Semicontronic

India . 747 parts In-Stock

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$6.410

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$6.250

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$6.218

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DigiPath Technology Company

USA . 541 parts In-Stock

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$6.682

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$6.147

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ChromeModa Solutions

Germany . 5,692 parts In-Stock

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$6.818

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$5.591

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IDEA Electronic Components Group

UK . 1,747 parts In-Stock

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AZTECH Wire

Italy . 898 parts In-Stock

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Component Stockers USA

USA . 577 parts In-Stock

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Microchip USA

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Kepictronics

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Corphita

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Overview

Experience superior performance and reliability with the TLC339CNS comparator from Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-notch quality and precision engineering in all their products. Ideal for a wide range of applications, this comparator offers unmatched value and benefits to customers. Whether you're designing automotive systems, industrial controls, or consumer electronics, the TLC339CNS provides fast response times and low power consumption, making it the perfect choice for your next project. Trust Texas Instruments to deliver excellence every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is durable and suitable for a wide range of operating conditions, making this product a reliable choice.

Maximum Input Offset Voltage: 6500 uV

High maximum input offset voltage allows for accurate comparisons between input signals, ensuring precise measurements.

Maximum Average Bias Current (IIB): 0.0006 uA

Low bias current ensures minimal interference with input signals, resulting in accurate and reliable output.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving space and reducing assembly time.

Nominal Supply Voltage / Vsup (V): 5

Stable nominal supply voltage of 5V ensures consistent performance and compatibility with various electronic systems.

Maximum Operating Temperature: 70 °C

Wide maximum operating temperature range of 70°C enables the product to function reliably in different environmental conditions.

Output Type: OPEN-DRAIN

Open-drain output type allows for easy interfacing with other components, enhancing the overall versatility of the product.

Nominal Response Time: 2500 ns

Fast nominal response time of 2500ns ensures quick and efficient signal processing, making this product suitable for time-sensitive applications.

Technology: CMOS

CMOS technology offers low power consumption, high speed operation, and noise immunity, making this product energy-efficient and reliable.

Technical Specifications

Comparators TLC339CNS attributes and parameters. Explore more Comparators devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Technology:

CMOS

Total Functions:

4

Sub-Category:

Comparators

Output Type:

Open-Drain

Performance Specifications

Maximum Input Offset Voltage:

6.5 mV

Peak Bias Current:

600 pA

Operational Characteristics

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

18 V

Lowest Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Reflow Peak Time Limit:

30 s

Peak Reflow Temperature:

260 °C (500 °F)

Nominal Response Time:

2.5 µs

Physical Characteristics

Length:

0.402 in (10.2 mm)

Width:

0.209 in (5.3 mm)

Maximum Seated Height:

0.079 in (2 mm)

Total Terminals:

14

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Packaging and Shipping

Package Code:

SOP

Package Shape:

Package Type:

Small Outline

Trade Compliance

TLC339CNS Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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