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TLC320AD90CFN

Texas Instruments

TLC320AD90CFN by Texas Instruments

TLC320AD90CFN by Texas Instruments is a 64-terminal consumer IC in a square chip carrier package. It operates b/w 0-70°C with supply voltage range of 4.75-5.25V, suitable for commercial applications requiring high-quality audio processing in compact electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,387 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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5,387

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-

-

-

Digiode

USA . 3,472 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

3,472

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-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,103 parts In-Stock

1+ parts

$0.910

100+ parts

-

1k+ parts

$1.833

10k+ parts

-

1,103

$0.910

-

$1.833

-

Advanced Electronics

New Zealand . 40 parts In-Stock

1+ parts

$0.970

100+ parts

$0.883

1k+ parts

$0.795

10k+ parts

-

40

$0.970

$0.883

$0.795

-

DigiPath Technology Company

USA . 2,280 parts In-Stock

1+ parts

$1.003

100+ parts

$0.922

1k+ parts

-

10k+ parts

-

2,280

$1.003

$0.922

-

-

ChromeModa Solutions

Germany . 2,605 parts In-Stock

1+ parts

$1.023

100+ parts

$0.839

1k+ parts

-

10k+ parts

-

2,605

$1.023

$0.839

-

-

IDEA Electronic Components Group

UK . 852 parts In-Stock

1+ parts

$1.023

100+ parts

-

1k+ parts

$0.921

10k+ parts

-

852

$1.023

-

$0.921

-

AZTECH Wire

Italy . 897 parts In-Stock

1+ parts

$9.503

100+ parts

-

1k+ parts

-

10k+ parts

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897

$9.503

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-

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One Stop Electronics

USA . 633 parts In-Stock

1+ parts

$12.800

100+ parts

-

1k+ parts

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10k+ parts

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633

$12.800

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-

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Corphita

USA . 3,631 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,631

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Overview

Elevate your consumer electronics with the Texas Instruments TLC320AD90CFN, a cutting-edge consumer circuit that sets the standard for quality and performance. With Texas Instruments' reputation for excellence, rest assured that this chip carrier package delivers unmatched reliability and innovation. Perfect for a range of applications, this square-shaped IC boasts a temperature grade suitable for commercial use and a surface mount design for easy integration. Elevate your product designs with the TLC320AD90CFN and experience the value and benefits it brings to your customers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is durable and cost-effective, making the product suitable for consumer applications.

Surface Mount: YES

Surface mount technology allows for compact and efficient PCB design, saving space and enhancing production efficiency.

Package Shape: SQUARE

Square package shape is easier to handle and mount compared to other shapes, improving ease of use during assembly.

No. of Terminals: 64

With 64 terminals, the product offers versatility in connecting various components and peripherals, making it suitable for a wide range of applications.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, the product can operate reliably in most consumer electronic devices.

Minimum Operating Temperature: 0 °C

The product can function even in low-temperature environments, providing reliable performance under various conditions.

Minimum Supply Voltage (Vsup): 4.75 V

The low minimum supply voltage requirement makes the product energy-efficient and compatible with a wide range of power sources.

Maximum Supply Voltage (Vsup): 5.25 V

The product can handle a maximum supply voltage of 5.25V without damage, ensuring robust performance and protection against voltage spikes.

Technical Specifications

Other Function Consumer ICs TLC320AD90CFN attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PQCC-N64

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Position:

QUAD

Trade Compliance

TLC320AD90CFN General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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