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TLC320AD77CDBR

Texas Instruments

TLC320AD77CDBR by Texas Instruments

TLC320AD77CDBR by Texas Instruments is a consumer IC with 28 terminals, operating at 3.3V. It has a small outline package style and can withstand temperatures from 0 to 70°C. Ideal for applications requiring high-quality audio processing in commercial-grade environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,149 parts In-Stock

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Chip Stock

USA . 3,420 parts In-Stock

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3,420

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Digiode

USA . 2,050 parts In-Stock

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Nova Conductors

Japan . 93 parts In-Stock

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Parana Technologies

USA . 1,571 parts In-Stock

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$3.338

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$3.863

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$3.338

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$3.863

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DigiPath Technology Company

USA . 1,818 parts In-Stock

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$3.676

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$3.676

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ChromeModa Solutions

Germany . 5,298 parts In-Stock

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$3.751

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$3.076

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$3.751

$3.076

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IDEA Electronic Components Group

UK . 1,401 parts In-Stock

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$3.751

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$3.376

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$3.376

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Ampacity Inc.

Singapore . 644 parts In-Stock

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$3.800

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$3.800

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AZTECH Wire

Italy . 485 parts In-Stock

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$11.423

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One Stop Electronics

USA . 1,352 parts In-Stock

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$11.800

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Kepictronics

USA . 9,000 parts In-Stock

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Lixinc

USA . 8,614 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,822 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Corphita

USA . 4,632 parts In-Stock

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Bastille Electronics

Australia . 200 parts In-Stock

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200

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Microchip USA

USA . 164 parts In-Stock

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Overview

Elevate your consumer electronic designs with the Texas Instruments TLC320AD77CDBR, a high-quality IC that offers unmatched performance and reliability. Manufactured by industry leader Texas Instruments, this innovative product is perfect for a wide range of applications in the consumer electronics category. With its advanced features and cutting-edge technology, the TLC320AD77CDBR provides exceptional value and benefits to customers looking to enhance their products. Trust Texas Instruments for top-of-the-line solutions that deliver superior results every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight, durable, and cost-effective, making the product suitable for a wide range of consumer applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly processes, making the product suitable for high volume production.

Package Shape: RECTANGULAR

The rectangular shape helps in efficient utilization of space on PCBs, making it ideal for compact electronic devices.

Power Supplies (V): 3.3

The low power supply requirement of 3.3V helps in reducing power consumption, making the product energy efficient.

No. of Terminals: 28

Having a higher number of terminals allows for more connectivity options, making the product versatile in its applications.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature range ensures reliability and stability of the product even in harsh environments.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature allows the product to function effectively in a wide range of temperature conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

This finish provides excellent conductivity and corrosion resistance, ensuring long-term performance and reliability.

Width: 5.3 mm

The compact width of the product allows for easy integration into various electronic devices without taking up much space.

Minimum Supply Voltage (Vsup): 3 V

The minimum supply voltage requirement of 3V enables compatibility with a wide range of power sources, making the product versatile.

Maximum Time At Peak Reflow Temperature (s): 30

The short reflow time of 30 seconds reduces the risk of component damage during assembly processes, ensuring product reliability.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance of 260°C allows for reliable soldering processes, ensuring the durability of the product.

Length: 10.2 mm

The compact length of the product makes it suitable for use in small electronic devices where space is a constraint.

Temperature Grade: COMMERCIAL

The commercial temperature grade ensures the product's performance in standard operating conditions, making it suitable for consumer applications.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering onto PCBs, ensuring reliable electrical connections for the product.

Terminal Pitch: 0.65 mm

The small terminal pitch of 0.65mm allows for compact placement of terminals on the package, enabling high-density PCB designs.

Maximum Supply Voltage (Vsup): 3.6 V

The maximum supply voltage tolerance of 3.6V ensures the product's robustness against voltage fluctuations, enhancing its reliability.

Technical Specifications

Other Function Consumer ICs TLC320AD77CDBR attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

10.2 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP28,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5.3 mm

Trade Compliance

TLC320AD77CDBR General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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