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TLC320AD77CDBRG4

Texas Instruments

TLC320AD77CDBRG4 by Texas Instruments

TLC320AD77CDBRG4 by Texas Instruments is a consumer IC with 28 terminals, operating at 3.3V. It has a small outline package style and can withstand temperatures from 0 to 70°C. Ideal for applications requiring high-quality audio processing in commercial-grade devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,183 parts In-Stock

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Chip Stock

USA . 3,430 parts In-Stock

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Digiode

USA . 2,971 parts In-Stock

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Nova Conductors

Japan . 98 parts In-Stock

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Distributors (Availability)

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Parana Technologies

USA . 1,310 parts In-Stock

1+ parts

$3.116

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$3.636

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1,310

$3.116

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$3.636

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ChromeModa Solutions

Germany . 1,652 parts In-Stock

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$3.501

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$2.871

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$3.501

$2.871

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IDEA Electronic Components Group

UK . 1,040 parts In-Stock

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$3.501

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$3.151

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$3.501

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$3.151

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Ampacity Inc.

Singapore . 1,050 parts In-Stock

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$3.800

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$3.800

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One Stop Electronics

USA . 1,015 parts In-Stock

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$3.800

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$3.800

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AZTECH Wire

Italy . 619 parts In-Stock

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$5.181

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619

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Corphita

USA . 2,040 parts In-Stock

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Kepictronics

USA . 550 parts In-Stock

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550

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Bastille Electronics

Australia . 100 parts In-Stock

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DigiPath Technology Company

USA . 61 parts In-Stock

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$3.157

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Overview

Elevate your electronic projects with the Texas Instruments TLC320AD77CDBRG4, a high-quality consumer circuit designed to enhance audio performance. With Texas Instruments' reputation for excellence in semiconductor manufacturing, this small outline, shrink pitch IC offers unparalleled value and precision. Perfect for a wide range of applications, from consumer electronics to industrial automation, this versatile component provides customers with superior functionality and reliability. Experience the benefits of cutting-edge technology with the TLC320AD77CDBRG4 by Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation properties and helps in reducing the overall weight of the product.

Surface Mount: YES

Surface mount package allows for easy and efficient PCB assembly.

Package Shape: RECTANGULAR

Rectangular shape allows for compact and space-efficient designs.

Power Supplies (V): 3.3

Operates at a common and widely used voltage level, making it compatible with various systems.

No. of Terminals: 28

Sufficient number of terminals for connecting to various components and peripherals.

Maximum Operating Temperature: 70 °C

Can operate efficiently even in higher temperature environments.

Minimum Operating Temperature: 0 °C

Capable of functioning in low temperature conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides corrosion resistance and reliable electrical connections.

Terminal Position: DUAL

Dual terminal position for enhanced connectivity options.

Maximum Seated Height: 2 mm

Low profile design for space-saving applications.

Width: 5.3 mm

Narrow width for compact integration in electronic devices.

Minimum Supply Voltage (Vsup): 3 V

Low minimum supply voltage for efficient power consumption.

Peak Reflow Temperature °C: 260

Can withstand high reflow temperatures during assembly process.

Length: 10.2 mm

Compact length for accommodating in small form factor designs.

Temperature Grade: COMMERCIAL

Suitable for commercial applications where temperature variations are within specified limits.

Terminal Form: GULL WING

Gull wing terminal form for reliable solder connections.

Terminal Pitch: 0.65 mm

Fine pitch terminals for high density PCB layouts.

Maximum Supply Voltage (Vsup): 3.6 V

Operates within safe voltage limits for long-term reliability.

Technical Specifications

Other Function Consumer ICs TLC320AD77CDBRG4 attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

10.2 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP28,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5.3 mm

Trade Compliance

TLC320AD77CDBRG4 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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