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TLC193MFKB

Texas Instruments

TLC193MFKB by Texas Instruments

TLC193MFKB by Texas Instruments is a CMOS Comparator with 2 functions, featuring a max input offset voltage of 10000 uV and max supply current of 0.09 mA. Ideal for military applications due to its MILITARY temperature grade, it operates b/w -55 to 125 °C and has a package style of CHIP CARRIER.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,794 parts In-Stock

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Digiode

USA . 4,496 parts In-Stock

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4,496

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Distributors (Availability)

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Parana Technologies

USA . 954 parts In-Stock

1+ parts

$6.154

100+ parts

-

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$6.924

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954

$6.154

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$6.924

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Semicontronic

India . 1,598 parts In-Stock

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$6.410

100+ parts

$6.250

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$6.218

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1,598

$6.410

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$6.218

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ChromeModa Solutions

Germany . 5,634 parts In-Stock

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$6.915

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$5.670

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$6.915

$5.670

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IDEA Electronic Components Group

UK . 1,403 parts In-Stock

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$6.915

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$6.224

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1,403

$6.915

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$6.224

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One Stop Electronics

USA . 1,305 parts In-Stock

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$8.410

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1,305

$8.410

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Ampacity Inc.

Singapore . 1,448 parts In-Stock

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$9.410

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1,448

$9.410

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AZTECH Wire

Italy . 465 parts In-Stock

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$13.061

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465

$13.061

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Corphita

USA . 1,800 parts In-Stock

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Corohmni

South Africa . 152 parts In-Stock

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DigiPath Technology Company

USA . 28 parts In-Stock

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$6.235

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$6.235

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Overview

Enhance your electronic systems with the TLC193MFKB by Texas Instruments, a top-quality comparator designed to deliver precision and reliability. Crafted by the renowned manufacturer Texas Instruments, this product guarantees superior performance in a variety of applications. Whether you're working on industrial equipment or consumer electronics, the TLC193MFKB offers unmatched value with its low power consumption and high speed response time. Trust in Texas Instruments to provide cutting-edge technology that meets all your needs.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The use of ceramic and metal-sealed cofired material ensures high durability and reliability in various operating conditions.

Maximum Input Offset Voltage: 10000 uV

High maximum input offset voltage allows for precise comparisons between input signals.

Surface Mount: YES

Ease of installation and integration onto circuit boards for efficient use in electronic applications.

Nominal Supply Voltage / Vsup (V): 5

Standard nominal supply voltage for compatibility with common power sources.

Maximum Operating Temperature: 125 °C

Wide operating temperature range enables performance in diverse environments.

Output Type: OPEN-DRAIN

Open-drain output allows for easy interfacing with other components or devices.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for efficient operation.

Technical Specifications

Comparators TLC193MFKB attributes and parameters. Explore more Comparators devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Technology:

CMOS

Power Supply:

5/10 V

Total Functions:

2

Sub-Category:

Comparators

Output Type:

Open-Drain

Performance Specifications

Maximum Input Offset Voltage:

10 mV

Peak Bias Current:

30 nA

Operational Characteristics

Maximum Supply Current:

90 μA

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

18 V

Lowest Operating Temperature:

-55 °C (-67 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Nominal Response Time:

2.5 µs

Physical Characteristics

Length:

0.35 in (8.89 mm)

Width:

0.35 in (8.89 mm)

Maximum Seated Height:

0.08 in (2.03 mm)

Total Terminals:

20

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Quad

Terminal Form:

Package Body Material:

Ceramic, Metal-Sealed Cofired

Surface Mount:

Yes

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

S-CQCC-N20

Packaging and Shipping

Package Code:

Package Shape:

Package Type:

Chip Carrier

Package Equivalence Code:

LCC20,.35SQ

Trade Compliance

TLC193MFKB Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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