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TLC139MFKB

Texas Instruments

TLC139MFKB by Texas Instruments

TLC139MFKB by Texas Instruments is a CMOS COMPARATOR with 4 functions, 20 terminals, and OPEN-COLLECTOR output. It operates b/w -55 to 125 °C with a response time of 2500 ns. Ideal for military applications due to its MILITARY grade and TUBE packing method.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,773 parts In-Stock

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Digiode

USA . 420 parts In-Stock

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420

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Distributors (Availability)

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Parana Technologies

USA . 120 parts In-Stock

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$1.568

100+ parts

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$2.210

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120

$1.568

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$2.210

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ChromeModa Solutions

Germany . 4,045 parts In-Stock

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$1.762

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$1.445

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4,045

$1.762

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IDEA Electronic Components Group

UK . 1,729 parts In-Stock

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$1.762

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$1.586

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$1.762

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$1.586

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One Stop Electronics

USA . 493 parts In-Stock

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$2.410

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493

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Advanced Electronics

New Zealand . 41 parts In-Stock

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$7.486

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$6.812

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$6.139

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41

$7.486

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$6.139

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AZTECH Wire

Italy . 461 parts In-Stock

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$10.563

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Corphita

USA . 3,550 parts In-Stock

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Microchip USA

USA . 2,968 parts In-Stock

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DigiPath Technology Company

USA . 1,185 parts In-Stock

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$1.589

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Kepictronics

USA . 151 parts In-Stock

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Overview

Enhance your electronic designs with the TLC139MFKB by Texas Instruments, a top-quality comparator that offers precision and reliability. Manufactured by the trusted name in semiconductor technology, Texas Instruments, this chip carrier package features open-collector and open-drain outputs for versatile applications. Whether you're working on military-grade equipment or consumer electronics, this product's low bias current and fast response time ensure optimal performance. Trust Texas Instruments to deliver cutting-edge technology for your projects.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic package body material provides better thermal resistance and electrical insulation, ensuring reliability in various operating conditions.

Maximum Input Offset Voltage: 10000 uV

Low input offset voltage ensures accurate and precise comparator operation, making it suitable for high-precision applications.

Maximum Average Bias Current (IIB): 0.03 uA

Low bias current minimizes power consumption and improves overall efficiency of the comparator.

Surface Mount: YES

Surface mount capability allows for easy and convenient PCB integration, saving space and simplifying assembly processes.

No. of Functions: 4

Having multiple functions in one device simplifies circuit design and reduces component count, making the product cost-effective and efficient.

Nominal Supply Voltage / Vsup (V): 5

The nominal supply voltage of 5V is commonly used and easily accessible, making the comparator compatible with a wide range of applications.

Output Type: OPEN-COLLECTOR; OPEN-DRAIN

Multiple output types provide flexibility in connectivity options, allowing the comparator to be easily integrated into different circuit configurations.

Temperature Grade: MILITARY

Military-grade temperature tolerance ensures reliable operation in harsh environmental conditions, making the comparator suitable for rugged applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the overall performance and efficiency of the comparator.

Technical Specifications

Comparators TLC139MFKB attributes and parameters. Explore more Comparators devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Technology:

CMOS

Power Supply:

5 V

Total Functions:

4

Sub-Category:

Comparators

Output Type:

Open-Collector, Open-Drain

Performance Specifications

Maximum Input Offset Voltage:

10 mV

Peak Bias Current:

30 nA

Maximum Bias Current (IIB) @25 °C:

30 pA

Operational Characteristics

Maximum Supply Current:

80 μA

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

18 V

Lowest Operating Temperature:

-55 °C (-67 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Nominal Response Time:

2.5 µs

Physical Characteristics

Length:

0.35 in (8.89 mm)

Width:

0.35 in (8.89 mm)

Maximum Seated Height:

0.08 in (2.03 mm)

Total Terminals:

20

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Quad

Terminal Form:

Terminal Finish:

Tin Lead

Package Body Material:

Ceramic, Metal-Sealed Cofired

Surface Mount:

Yes

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Screening Level:

38535Q/M;38534H;883B

Standards

JESD-30 Code:

S-CQCC-N20

JESD-609 Code:

e0

Packaging and Shipping

Packing Method:

Tube

Package Code:

Package Shape:

Package Type:

Chip Carrier

Package Equivalence Code:

LCC20,.35SQ

Trade Compliance

TLC139MFKB Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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