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TLC14N

Texas Instruments

TLC14N by Texas Instruments

TLC14N by Texas Instruments is a CMOS active filter with 8 terminals and +-2.5/+-5V power supplies. It features a switched capacitor filter with Butterworth transfer characteristics, ideal for lowpass response applications in commercial temperature grades. The package is rectangular in shape, made of plastic/epoxy material, and has through-hole terminals at 2.54mm pitch.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,410 parts In-Stock

1+ parts

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6,410

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Digiode

USA . 785 parts In-Stock

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785

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 258 parts In-Stock

1+ parts

$5.690

100+ parts

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258

$5.690

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Parana Technologies

USA . 1,939 parts In-Stock

1+ parts

$7.936

100+ parts

-

1k+ parts

$8.498

10k+ parts

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1,939

$7.936

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$8.498

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DigiPath Technology Company

USA . 1,715 parts In-Stock

1+ parts

$8.739

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1,715

$8.739

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ChromeModa Solutions

Germany . 2,547 parts In-Stock

1+ parts

$8.917

100+ parts

$7.312

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2,547

$8.917

$7.312

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IDEA Electronic Components Group

UK . 1,349 parts In-Stock

1+ parts

$8.917

100+ parts

$8.471

1k+ parts

$8.025

10k+ parts

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1,349

$8.917

$8.471

$8.025

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AZTECH Wire

Italy . 429 parts In-Stock

1+ parts

$9.115

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429

$9.115

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Corphita

USA . 3,896 parts In-Stock

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3,896

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Overview

Enhance your electronic designs with the Texas Instruments TLC14N active filter. Crafted with precision and expertise, this switched capacitor filter offers unparalleled quality and reliability. Whether you're working on audio equipment, telecommunications systems, or medical devices, the TLC14N delivers exceptional performance and versatility. Experience the value of smooth signal processing, improved noise reduction, and enhanced overall functionality with this innovative solution. Choose Texas Instruments for cutting-edge technology that brings your projects to life.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good protection for the internal components of the active filter, ensuring durability and reliability.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the active filter energy-efficient and reliable in operation.

Package Shape: RECTANGULAR

The rectangular shape makes it easy to fit the active filter into various electronic devices or circuit designs without wasting space.

Terminal Form: THROUGH-HOLE

Through-hole terminals allow for easy and secure connections to other components or PCBs, enhancing the overall stability of the active filter.

Active Filter Type: SWITCHED CAPACITOR FILTER

Switched capacitor filters are known for their accurate and adjustable filtering capabilities, making this active filter a versatile choice for different applications.

Power Supplies (V): +-2.5/+-5

The dual power supply options of +-2.5V and +-5V provide flexibility in designing and operating the active filter in different voltage environments.

No. of Terminals: 8

Having 8 terminals allows for more connections and configurations, enabling the active filter to handle a variety of input and output signals effectively.

Package Style (Meter): IN-LINE

The in-line package style makes it convenient to integrate the active filter into existing circuit layouts, simplifying the overall design process.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this active filter can withstand higher temperature environments, ensuring reliable performance in various conditions.

Terminal Pitch: 2.54 mm

The 2.54mm terminal pitch provides ample space for connections and reduces the risk of short circuits, enhancing the overall safety and stability of the active filter.

Minimum Operating Temperature: 0 °C

The active filter can operate in temperatures as low as 0°C, making it suitable for use in cold environments or where temperature fluctuations occur.

Terminal Position: DUAL

Having dual terminal positions offers more flexibility in connecting the active filter to other components or systems, making it easier to integrate into various designs.

Response Type: LOWPASS

A lowpass response type allows the active filter to pass low-frequency signals while attenuating high-frequency noise, making it ideal for applications where filtering out unwanted noise is crucial.

Transfer Characteristics: BUTTERWORTH

Butterworth transfer characteristics provide a maximally flat frequency response in the passband, ensuring accurate signal processing and filtering with minimal distortion.

Temperature Grade: COMMERCIAL

The commercial temperature grade indicates that this active filter is designed for standard operating conditions typically found in commercial electronic devices, making it a reliable choice for various applications.

Technical Specifications

Active Filters TLC14N attributes and parameters. Explore more Active Filters devices from Texas Instruments

Electrical Characteristics

Power Supply:

±2.5/±5 V

Performance Parameters

Semiconductor Technology:

CMOS

Response Type:

Filter Technology:

Transfer Characteristics:

Butterworth

Filter Order:

4th

Environmental Characteristics

Maximum Operating Temperature:

70 °C (158 °F)

Minimum Operating Temperature:

0 °C (32 °F)

Temperature Grade:

Connectivity

Total Functions:

1

Total Terminals:

8

Terminal Form:

Terminal Pitch:

0.1 in (2.54 mm)

Terminal Position:

Dual

Physical Characteristics

Package Style:

In-Line

Form Factor:

Rectangular

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Body Material:

Plastic/Epoxy

Surface Mounting:

No

JESD-30 Code:

R-PDIP-T8

Additional Features

Qualified:

No

Trade Compliance

TLC14N Active Filters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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