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TLC10FN

Texas Instruments

TLC10FN by Texas Instruments

The Texas Instruments TLC10FN is a CMOS active filter with 2 functions, featuring a switched capacitor design. With 20 terminals in a square chip carrier package, it offers universal response types like Butterworth and Chebyshev. Ideal for commercial applications, operating b/w 0°C to 70°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,192 parts In-Stock

1+ parts

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3,192

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Digiode

USA . 1,145 parts In-Stock

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1,145

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 723 parts In-Stock

1+ parts

$6.690

100+ parts

-

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723

$6.690

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AZTECH Wire

Italy . 656 parts In-Stock

1+ parts

$14.427

100+ parts

-

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656

$14.427

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Parana Technologies

USA . 1,028 parts In-Stock

1+ parts

$20.125

100+ parts

$1,868.882

1k+ parts

$18.112

10k+ parts

-

1,028

$20.125

$1,868.882

$18.112

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DigiPath Technology Company

USA . 351 parts In-Stock

1+ parts

$22.160

100+ parts

-

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351

$22.160

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ChromeModa Solutions

Germany . 863 parts In-Stock

1+ parts

$22.612

100+ parts

$18.542

1k+ parts

-

10k+ parts

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863

$22.612

$18.542

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IDEA Electronic Components Group

UK . 172 parts In-Stock

1+ parts

$22.612

100+ parts

$21.481

1k+ parts

$20.351

10k+ parts

-

172

$22.612

$21.481

$20.351

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Corphita

USA . 1,670 parts In-Stock

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1,670

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Overview

Elevate your audio experience with the TLC10FN from Texas Instruments. As a leader in semiconductor manufacturing, TI delivers top-quality active filters that are perfect for a variety of applications. Whether you're looking to enhance sound quality in audio equipment or improve signal processing in communication systems, this product offers unmatched value and performance. Say goodbye to noise interference and hello to crystal-clear sound with the TLC10FN.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable applications.

Surface Mount: YES

Allows for easy and efficient assembly on circuit boards, saving space and reducing manufacturing costs.

No. of Functions: 2

Having 2 functions in one component streamlines the design process and reduces the number of components needed in the circuit.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making the product energy-efficient and reliable.

Package Shape: SQUARE

The square shape allows for easier placement on the PCB and efficient use of space.

Terminal Form: J BEND

J bend terminals provide secure connections and ease of insertion during assembly.

Active Filter Type: SWITCHED CAPACITOR FILTER

Switched capacitor filters offer high precision and low noise, resulting in better signal quality in the filtered output.

No. of Terminals: 20

Having 20 terminals allows for more connectivity options and compatibility with a wider range of circuits.

Package Style (Meter): CHIP CARRIER

Chip carrier package style enhances thermal performance and reliability in high-frequency applications.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, the product is suitable for a wide range of ambient conditions.

Terminal Pitch: 1.27 mm

The small terminal pitch of 1.27mm enables high-density mounting and contributes to compact circuit design.

Minimum Operating Temperature: 0 °C

The product can operate in low-temperature environments down to 0°C, ensuring versatility in various temperature conditions.

Terminal Position: QUAD

Having quad terminal positions provides flexibility in circuit connection and allows for different configurations to be easily implemented.

Response Type: UNIVERSAL

Universal response type offers versatility in signal filtering and processing, making the product adaptable to different applications.

Transfer Characteristics: BUTTERWORTH/BESSEL/ELLIPTIC/CHEBYSHEV

The multiple transfer characteristics options allow for customization and optimization of the filter response based on specific requirements.

Temperature Grade: COMMERCIAL

The commercial temperature grade ensures stable performance in standard operating conditions, making the product suitable for general commercial applications.

Technical Specifications

Active Filters TLC10FN attributes and parameters. Explore more Active Filters devices from Texas Instruments

Performance Parameters

Semiconductor Technology:

CMOS

Response Type:

Filter Technology:

Transfer Characteristics:

Butterworth/Bessel/Elliptical/Chebyshev

Filter Order:

2nd

Environmental Characteristics

Maximum Operating Temperature:

70 °C (158 °F)

Minimum Operating Temperature:

0 °C (32 °F)

Temperature Grade:

Connectivity

Total Functions:

2

Total Terminals:

20

Terminal Form:

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Quad

Physical Characteristics

Package Style:

Chip Carrier

Form Factor:

Square

Package Code:

Package Equivalence Code:

LDCC20,.4SQ

Package Body Material:

Plastic/Epoxy

Surface Mounting:

Yes

JESD-30 Code:

S-PQCC-J20

Additional Features

Qualified:

No

Trade Compliance

TLC10FN Active Filters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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