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TL710MJ

Texas Instruments

TL710MJ by Texas Instruments

TL710MJ by Texas Instruments is a MILITARY-grade COMPARATOR with 14 terminals in RECTANGULAR CERAMIC package. Operating temperature range from -55 to 125 °C makes it ideal for harsh environments. BIPOLAR technology and DUAL terminal position ensure reliable performance in critical applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,515 parts In-Stock

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Vyrian

USA . 2,240 parts In-Stock

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2,240

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ACDS - Activité Composants Distribution Service

France . 141 parts In-Stock

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141

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ECAB

Sweden . 19 parts In-Stock

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Electronic Expediters

USA . 5 parts In-Stock

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Holdelec - ElecDif-Pro

France . 3 parts In-Stock

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Parana Technologies

USA . 2,332 parts In-Stock

1+ parts

$4.039

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-

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$4.502

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2,332

$4.039

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$4.502

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ChromeModa Solutions

Germany . 1,499 parts In-Stock

1+ parts

$4.538

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$3.721

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1,499

$4.538

$3.721

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IDEA Electronic Components Group

UK . 530 parts In-Stock

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$4.538

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$4.084

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530

$4.538

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$4.084

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One Stop Electronics

USA . 820 parts In-Stock

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$7.410

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820

$7.410

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AZTECH Wire

Italy . 854 parts In-Stock

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$11.041

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854

$11.041

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DigiPath Technology Company

USA . 1,105 parts In-Stock

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$4.091

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$4.091

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Cyclops Electronics Ltd (Excess)

UK . 141 parts In-Stock

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141

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Corphita

USA . 140 parts In-Stock

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140

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Overview

Unlock the power of precision with the TL710MJ comparator by Texas Instruments. Crafted with quality ceramic packaging and military-grade temperature specifications, this device offers unparalleled reliability in a compact, 14-terminal design. Ideal for applications where accuracy is paramount, the TL710MJ ensures seamless performance in critical systems. Trust Texas Instruments to deliver superior technology that exceeds expectations. Experience the value of efficiency and precision with the TL710MJ.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides high thermal conductivity and excellent stability, making the product durable and reliable.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration into existing electronic systems and provides a compact design.

No. of Terminals: 14

Having 14 terminals increases the versatility of the product, allowing for more connections and functions.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures that the product can withstand demanding conditions without malfunctioning.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature ensures that the product can operate in a wide range of environments, including extreme cold.

Technology: BIPOLAR

Bipolar technology provides accurate and stable performance, making the product suitable for precision applications.

Terminal Form: THROUGH-HOLE

Through-hole terminals make it easy to solder and secure connections, ensuring a reliable and robust setup.

Technical Specifications

Comparators TL710MJ attributes and parameters. Explore more Comparators devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Technology:

BIPOLAR

Sub-Category:

Comparators

Operational Characteristics

Lowest Operating Temperature:

-55 °C (-67 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Physical Characteristics

Total Terminals:

14

Terminal Pitch:

0.1 in (2.54 mm)

Terminal Position:

Dual

Terminal Form:

Package Body Material:

Ceramic

Surface Mount:

No

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-XDIP-T14

Packaging and Shipping

Package Code:

DIP

Package Shape:

Package Type:

In-Line

Package Equivalence Code:

DIP14,.3

Trade Compliance

TL710MJ Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-00-328-0244, 5962003280244, 5962-14-402-2107, 5962144022107

NIIN

003280244, 144022107

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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