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TL710CNP3

Texas Instruments

TL710CNP3 by Texas Instruments

TL710CNP3 by Texas Instruments is a 14-terminal comparator with bipolar technology. Operating temperature range of 0-70°C makes it suitable for commercial applications. Packaged in plastic/epoxy, it has a rectangular shape and through-hole terminals, ideal for various electronic circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,798 parts In-Stock

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5,798

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Digiode

USA . 1,361 parts In-Stock

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1,361

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,236 parts In-Stock

1+ parts

$1.514

100+ parts

-

1k+ parts

$2.176

10k+ parts

-

2,236

$1.514

-

$2.176

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DigiPath Technology Company

USA . 812 parts In-Stock

1+ parts

$1.667

100+ parts

$1.534

1k+ parts

-

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812

$1.667

$1.534

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IDEA Electronic Components Group

UK . 1,616 parts In-Stock

1+ parts

$1.701

100+ parts

-

1k+ parts

$1.531

10k+ parts

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1,616

$1.701

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$1.531

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ChromeModa Solutions

Germany . 616 parts In-Stock

1+ parts

$1.701

100+ parts

$1.395

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-

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616

$1.701

$1.395

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One Stop Electronics

USA . 1,534 parts In-Stock

1+ parts

$9.410

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1,534

$9.410

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AZTECH Wire

Italy . 546 parts In-Stock

1+ parts

$9.898

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546

$9.898

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Corphita

USA . 4,285 parts In-Stock

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4,285

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Overview

Enhance your electronic designs with the TL710CNP3 comparator by Texas Instruments, known for its exceptional quality and reliability. This versatile component is perfect for a wide range of applications, offering precision performance and efficient operation. With Texas Instruments' reputation for innovation and excellence in the industry, you can trust that the TL710CNP3 will meet all your needs. Experience the value and benefits of this top-of-the-line comparator, providing unparalleled advantages to customers seeking high-quality solutions for their projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials offer good protection against environmental factors and mechanical stress, ensuring durability and reliability.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration and placement within circuit boards, optimizing space efficiency.

No. of Terminals: 14

Having 14 terminals provides flexibility in connecting various components, making it versatile for different circuit configurations.

Maximum Operating Temperature: 70 °C

With a high maximum temperature tolerance, the comparator can operate in a wide range of environments without the risk of overheating.

Technology: BIPOLAR

Bipolar technology offers high precision and accuracy in comparison operations, making this comparator suitable for precise measurement applications.

Amplifier Type: COMPARATOR

Being a comparator, this product is designed specifically for comparing two analog input signals, making it ideal for decision-making processes in electronic circuits.

Technical Specifications

Comparators TL710CNP3 attributes and parameters. Explore more Comparators devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Technology:

BIPOLAR

Sub-Category:

Comparators

Operational Characteristics

Lowest Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Physical Characteristics

Total Terminals:

14

Terminal Pitch:

0.1 in (2.54 mm)

Terminal Position:

Dual

Terminal Form:

Package Body Material:

Plastic/Epoxy

Surface Mount:

No

Manufacturing and Reliability

Temperature Grade:

Standards

JESD-30 Code:

R-PDIP-T14

Packaging and Shipping

Package Code:

DIP

Package Shape:

Package Type:

In-Line

Package Equivalence Code:

DIP14,.3

Trade Compliance

TL710CNP3 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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