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TL52055DRG4

Texas Instruments

TL52055DRG4 by Texas Instruments

TL52055DRG4 by Texas Instruments is a 16-terminal BICMOS multiplexer with 3 functions, suitable for industrial applications. It operates b/w -40 to 85°C, with supply voltage ranging from 4.5V to 9V. This small outline switch has a peak reflow temperature of 260°C and is surface mountable.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,192 parts In-Stock

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8,192

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Digiode

USA . 1,009 parts In-Stock

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1,009

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,131 parts In-Stock

1+ parts

$2.500

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-

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1,131

$2.500

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Parana Technologies

USA . 993 parts In-Stock

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$3.311

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-

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$3.834

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993

$3.311

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$3.834

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ChromeModa Solutions

Germany . 2,491 parts In-Stock

1+ parts

$3.720

100+ parts

$3.050

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2,491

$3.720

$3.050

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IDEA Electronic Components Group

UK . 2,290 parts In-Stock

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$3.720

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$3.348

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2,290

$3.720

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$3.348

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Semicontronic

India . 593 parts In-Stock

1+ parts

$4.500

100+ parts

$4.388

1k+ parts

$4.365

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593

$4.500

$4.388

$4.365

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AZTECH Wire

Italy . 874 parts In-Stock

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$5.203

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874

$5.203

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Ampacity Inc.

Singapore . 1,569 parts In-Stock

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$5.500

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1,569

$5.500

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Lixinc

USA . 17,957 parts In-Stock

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17,957

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DigiPath Technology Company

USA . 1,270 parts In-Stock

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$3.354

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1,270

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$3.354

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Corphita

USA . 487 parts In-Stock

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487

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Corohmni

South Africa . 321 parts In-Stock

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321

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Microchip USA

USA . 133 parts In-Stock

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Overview

Experience seamless and reliable signal routing with the TL52055DRG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments guarantees top-notch quality and performance. This multiplexer & switch offers versatility and efficiency, making it perfect for various applications in audio/video systems. With its compact design and advanced technology, customers can enjoy improved functionality and convenience. Trust Texas Instruments to deliver innovative solutions that enhance your systems' performance. Unlock new possibilities with the TL52055DRG4 today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is lightweight and durable, making the product easy to handle and long-lasting.

Surface Mount: YES

Surface mount technology allows for easy installation and space-saving design, making it suitable for compact applications.

No. of Functions: 3

Having multiple functions in one device can offer versatility and functionality in a single product.

Nominal Supply Voltage (Vsup): 5 V

Operates efficiently at a standard voltage, ensuring compatibility with most systems.

Maximum Operating Temperature: 85 °C

Can withstand high operating temperatures, ideal for industrial environments or applications that require extended use.

Technology: BICMOS

Utilizing BiCMOS technology combines the advantages of both bipolar and CMOS circuits, providing high-speed performance with low power consumption.

Technical Specifications

Multiplexers & Switches TL52055DRG4 attributes and parameters. Explore more Multiplexers & Switches devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

2

No. of Functions:

3

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/9

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Multiplexer or Switches

Maximum Supply Voltage (Vsup):

9 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

TL52055DRG4 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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