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TL032CDG4

Texas Instruments

TL032CDG4 by Texas Instruments

TL032CDG4 by Texas Instruments is a dual operational amplifier with low bias current of 0.0002 uA at 25C and micropower feature. It offers a min slew rate of 1.5 V/us, nominal common mode reject ratio of 87 dB, and nominal unity gain bandwidth of 1000 kHz. Ideal for applications requiring precise signal amplification in commercial temperature grade environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 35,860 parts In-Stock

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Vyrian

USA . 8,108 parts In-Stock

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8,108

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Digiode

USA . 1,568 parts In-Stock

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1,568

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Distributors (Availability)

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Ampacity Inc.

Singapore . 638 parts In-Stock

1+ parts

$0.410

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638

$0.410

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Corohmni

South Africa . 544 parts In-Stock

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$3.616

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544

$3.616

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One Stop Electronics

USA . 239 parts In-Stock

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$4.410

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239

$4.410

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Parana Technologies

USA . 752 parts In-Stock

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$5.720

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$6.512

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752

$5.720

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$6.512

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DigiPath Technology Company

USA . 1,667 parts In-Stock

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$6.298

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$6.298

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ChromeModa Solutions

Germany . 4,929 parts In-Stock

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$6.427

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$5.270

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4,929

$6.427

$5.270

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IDEA Electronic Components Group

UK . 300 parts In-Stock

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$6.427

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$5.784

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300

$6.427

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$5.784

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AZTECH Wire

Italy . 557 parts In-Stock

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$15.357

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557

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Corphita

USA . 4,402 parts In-Stock

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Continental Prestige Electronics

USA . 3,427 parts In-Stock

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Argo Parts USA

USA . 2,939 parts In-Stock

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Bastille Electronics

Australia . 450 parts In-Stock

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Overview

Enhance your electronic designs with the TL032CDG4 Operational Amplifier from Texas Instruments. Manufactured with precision and reliability in mind, this Op Amp offers unparalleled performance and versatility for a wide range of applications. Whether you're working on audio equipment, sensor interfaces, or signal conditioning circuits, this high-quality component delivers exceptional value, low bias current, and micropower capabilities. Trust Texas Instruments to provide the cutting-edge technology you need to bring your designs to life. Elevate your projects with the TL032CDG4 and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material offers good durability and reliability for the package, making the product suitable for various applications.

Maximum Input Offset Voltage: 4500 uV

Low input offset voltage allows for accurate signal processing and minimal error in the output signal.

Maximum Average Bias Current (IIB): 0.0004 uA

Low bias current ensures minimal power consumption and stable performance of the operational amplifier.

Surface Mount: YES

Surface mount capability makes installation and PCB assembly easier and more efficient.

Nominal Common Mode Reject Ratio: 87 dB

High common mode rejection ratio indicates good noise immunity and signal integrity in the amplifier.

Nominal Supply Voltage (Vsup): 5 V

Operates at a standard supply voltage of 5V, making it compatible with most electronic circuits and systems.

No. of Terminals: 8

Sufficient number of terminals for connectivity and functionality in various circuits and applications.

Minimum Slew Rate: 1.5 V/us

Fast slew rate allows for quick response to input signal changes, enabling high-speed signal processing.

Maximum Supply Voltage Limit: 18 V

Wide supply voltage range provides flexibility and compatibility with different power sources.

Minimum Voltage Gain: 3000

High voltage gain amplifies small input signals effectively, ensuring accurate amplification of the output signal.

Technology: BIFET

Bipolar and Field-Effect Transistor (BIFET) technology offers a combination of high input impedance and low input bias current for improved performance.

Maximum Negative Supply Voltage Limit: -18 V

Supports dual power supply operation with a negative voltage limit of -18V, enabling versatile circuit configurations.

Nominal Unity Gain Bandwidth: 1000 kHz

High unity gain bandwidth allows for stable and accurate amplification of signals across a wide frequency range.

Amplifier Type: OPERATIONAL AMPLIFIER

Operational amplifier design offers high gain, high input impedance, and low output impedance for various signal processing applications.

Temperature Grade: COMMERCIAL

Suitable for commercial temperature range applications, providing reliable performance in typical operating conditions.

Technical Specifications

Operational Amplifiers (Op Amps) TL032CDG4 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

BIFET

Power Supply:

±5/±15 V

Total Functions:

2

Sub-Category:

Operational Amplifiers

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

No

Micropower:

Yes

Performance Specifications

Nominal Unity Gain Bandwidth:

1 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

87 dB

Input Offset Voltage Limit:

4500 uV

Minimum Voltage Gain:

3000

Minimum Slew Rate:

1.5 V/us

Nominal Slew Rate:

2.2 V/us

Peak Bias Current:

400 pA

Maximum Bias Current (IIB) @25 °C:

200 pA

Operational Characteristics

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

18 V

Maximum Negative Supply Voltage:

-5 V

Minimum Negative Supply Voltage:

-18 V

Lowest Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

30 s

Maximum Supply Current:

560 μA

Physical Characteristics

Length:

0.193 in (4.9 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tube

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP8,.25

Trade Compliance

TL032CDG4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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