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OPA244NA

Texas Instruments

OPA244NA by Texas Instruments

OPA244NA by Texas Instruments is a micropower operational amplifier with a max input offset voltage of 2000 uV and nominal common mode reject ratio of 98 dB. It operates in industrial temperature range (-40 to 85 °C) and has a unity gain bandwidth of 430 kHz. Ideal for applications requiring low bias current and high precision amplification in small outline packages.

Median Price

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Lifecycle Status

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6

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Chip Stock

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Digiode

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Vyrian

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Nova Conductors

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Legend Electronics Inc.

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One Stop Electronics

USA . 1,158 parts In-Stock

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$2.410

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Aztec Data Supply Inc.

USA . 1,817 parts In-Stock

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$3.430

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Parana Technologies

USA . 1,481 parts In-Stock

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$4.033

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$4.496

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Corohmni

South Africa . 545 parts In-Stock

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DigiPath Technology Company

USA . 1,677 parts In-Stock

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$4.441

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$4.086

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ChromeModa Solutions

Germany . 1,042 parts In-Stock

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IDEA Electronic Components Group

UK . 244 parts In-Stock

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Semicontronic

India . 1,648 parts In-Stock

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Advanced Electronics

New Zealand . 81 parts In-Stock

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AZTECH Wire

Italy . 516 parts In-Stock

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Lixinc

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Metaverse IC Inc.

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Continental Prestige Electronics

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Lucentia Tech

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Overview

Enhance your electronic designs with the high-quality OPA244NA operational amplifier by Texas Instruments. This versatile component offers reliable performance and precision in a compact package, making it ideal for a wide range of applications. Whether you're working on audio equipment, industrial controls, or sensor interfaces, the OPA244NA delivers exceptional value with its low bias current, high common mode rejection ratio, and wide supply voltage range. Trust Texas Instruments to provide top-notch components that elevate your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and allows for easy handling and installation.

Maximum Input Offset Voltage: 2000 uV

Low input offset voltage ensures accurate and precise output signal.

Nominal Common Mode Reject Ratio: 98 dB

High common mode rejection ratio minimizes common mode noise interference for cleaner output signals.

Nominal Supply Voltage / Vsup (V): 7.5

Optimal supply voltage for efficient operation and performance.

Package Style (Meter): SMALL OUTLINE

Small outline package design saves space and facilitates compact circuit board layout.

Technology: BIPOLAR

Bipolar technology offers high performance and reliability for precise amplification.

Amplifier Type: OPERATIONAL AMPLIFIER

Operational amplifier design ensures versatility and flexibility for various circuit applications.

Technical Specifications

Operational Amplifiers (Op Amps) OPA244NA attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

BIPOLAR

Power Supply:

±1.1/±18/2.2/36 V

Total Functions:

1

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

No

Low-Offset:

No

Micropower:

Yes

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

430 kHz

Nominal Common Mode Rejection Ratio (CMRR ):

98 dB

Input Offset Voltage Limit:

2000 uV

Minimum Voltage Gain:

20000

Nominal Slew Rate:

0.16 V/us

Peak Bias Current:

-25 nA

Maximum Bias Current (IIB) @25 °C:

25 nA

Operational Characteristics

Nominal Supply Voltage:

7.5 V

Maximum Supply Voltage:

18 V

Maximum Negative Supply Voltage:

-7.5 V

Minimum Negative Supply Voltage:

-18 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Supply Current:

600 μA

Physical Characteristics

Total Terminals:

5

Terminal Pitch:

0.037 in (0.95 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

2

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Packaging and Shipping

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

TSOP5/6,.11,37

Trade Compliance

OPA244NA Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

NSN

5962-01-576-4437, 5962015764437

NIIN

015764437

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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