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TL032AIDRE4

Texas Instruments

TL032AIDRE4 by Texas Instruments

TL032AIDRE4 by Texas Instruments is a BIFET operational amplifier with 4600uV max input offset voltage, 1.5V/us min slew rate, and 87dB nominal CMRR. Ideal for industrial applications requiring low-bias amplification in a compact package style with dual terminals and micropower technology.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,429 parts In-Stock

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Digiode

USA . 2,847 parts In-Stock

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Nova Conductors

Japan . 870 parts In-Stock

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Parana Technologies

USA . 1,064 parts In-Stock

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$5.614

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$6.411

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$5.614

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$6.411

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ChromeModa Solutions

Germany . 4,203 parts In-Stock

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$6.308

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$5.173

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$6.308

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IDEA Electronic Components Group

UK . 832 parts In-Stock

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$6.308

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$5.677

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832

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Corohmni

South Africa . 87 parts In-Stock

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$6.532

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$6.532

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Ampacity Inc.

Singapore . 1,461 parts In-Stock

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$8.410

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One Stop Electronics

USA . 1,032 parts In-Stock

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$8.410

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$8.410

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AZTECH Wire

Italy . 213 parts In-Stock

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$16.463

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Continental Prestige Electronics

USA . 6,192 parts In-Stock

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Argo Parts USA

USA . 2,128 parts In-Stock

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Corphita

USA . 1,960 parts In-Stock

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DigiPath Technology Company

USA . 257 parts In-Stock

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Advanced Electronics

New Zealand . 100 parts In-Stock

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Bastille Electronics

Australia . 37 parts In-Stock

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Overview

Experience superior performance with the TL032AIDRE4 operational amplifier by Texas Instruments. As a leader in the industry, Texas Instruments delivers high-quality products that exceed expectations. The TL032AIDRE4 offers precision and reliability for a wide range of applications, ensuring optimal functionality and efficiency. Trust in Texas Instruments to provide you with the best-in-class operational amplifiers that deliver exceptional value and performance for all your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and provides good protection for the internal components of the op amp.

Maximum Input Offset Voltage: 4600 uV

Low input offset voltage helps in minimizing errors in the output signal, making this op amp suitable for precision applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V makes this op amp suitable for low-power applications.

Minimum Slew Rate: 1.5 V/us

Fast slew rate allows for quick response to input changes, making this op amp suitable for applications requiring high-speed signal processing.

Nominal Unity Gain Bandwidth: 1000 kHz

Having a high unity gain bandwidth ensures stable operation at different gain settings, making this op amp versatile for various applications.

Technical Specifications

Operational Amplifiers (Op Amps) TL032AIDRE4 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

BIFET

Power Supply:

±5/±15 V

Total Functions:

2

Sub-Category:

Operational Amplifiers

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

No

Micropower:

Yes

Performance Specifications

Nominal Unity Gain Bandwidth:

1 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

87 dB

Minimum Common Mode Rejection Ratio (CMRR ):

75 dB

Input Offset Voltage Limit:

4600 uV

Minimum Voltage Gain:

5000

Minimum Slew Rate:

1.5 V/us

Nominal Slew Rate:

2.3 V/us

Peak Bias Current:

900 pA

Maximum Bias Current (IIB) @25 °C:

200 pA

Operational Characteristics

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

18 V

Maximum Negative Supply Voltage:

-5 V

Minimum Negative Supply Voltage:

-18 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

30 s

Maximum Supply Current:

560 μA

Physical Characteristics

Length:

0.193 in (4.9 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP8,.25

Trade Compliance

TL032AIDRE4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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