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TISP7350F3D

Texas Instruments

TISP7350F3D by Texas Instruments

TISP7350F3D by Texas Instruments is a silicon surge protector with 4.3A peak current, 350V breakdown voltage, and thyristor trigger. It is used for surge protection in various applications due to its compact rectangular package and dual terminal position.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,320 parts In-Stock

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2,320

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Digiode

USA . 1,419 parts In-Stock

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1,419

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 1,095 parts In-Stock

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1,095

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Euro-Tech

UK . 50 parts In-Stock

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50

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Distributors (Availability)

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Parana Technologies

USA . 1,808 parts In-Stock

1+ parts

$3.873

100+ parts

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$4.355

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1,808

$3.873

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$4.355

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DigiPath Technology Company

USA . 2,193 parts In-Stock

1+ parts

$4.265

100+ parts

$3.924

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2,193

$4.265

$3.924

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ChromeModa Solutions

Germany . 4,737 parts In-Stock

1+ parts

$4.352

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$3.569

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4,737

$4.352

$3.569

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IDEA Electronic Components Group

UK . 560 parts In-Stock

1+ parts

$4.352

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$3.917

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560

$4.352

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$3.917

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AZTECH Wire

Italy . 885 parts In-Stock

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$8.756

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885

$8.756

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One Stop Electronics

USA . 452 parts In-Stock

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$11.100

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452

$11.100

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Corphita

USA . 3,539 parts In-Stock

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3,539

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Assy Fe

Spain . 225 parts In-Stock

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Overview

Upgrade your surge protection with the TISP7350F3D by Texas Instruments. Designed with quality in mind, this silicon surge protector offers superior protection for your electronic devices. The trusted manufacturer, Texas Instruments, has a reputation for excellence in the industry, ensuring reliability and peace of mind. Ideal for a variety of applications, this surge protector is a valuable investment for safeguarding your valuable equipment. Trust in the TISP7350F3D to keep your devices safe from power surges and enjoy the benefits of uninterrupted performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the components inside the surge protector, ensuring a longer lifespan.

Configuration: DELTA CONNECTED, 3 ELEMENTS

The delta connected configuration with 3 elements allows for effective and efficient surge protection for electronic devices.

Non Repetitive Peak On-state Current: 4.3 A

The high peak on-state current rating ensures that the surge protector can handle sudden surges of power without causing damage to connected devices.

Surface Mount: YES

The surface mount capability makes installation easy and convenient, saving time and effort.

Package Shape: RECTANGULAR

The rectangular shape provides a compact and space-saving design, ideal for various applications.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, this surge protector can withstand hot environments and continue to provide effective protection.

Trigger Device Type: THYRISTOR SURGE PROTECTOR

The thyristor surge protector type ensures fast and reliable response to surges, offering immediate protection to connected devices.

Maximum Breakdown Voltage: 350 V

The high maximum breakdown voltage means that the surge protector can effectively handle sudden spikes in voltage without compromising performance.

Technical Specifications

Silicon Surge Protectors TISP7350F3D attributes and parameters. Explore more Silicon Surge Protectors devices from Texas Instruments

Specs

Maximum Breakdown Voltage:

350 V

JEDEC-95 Code:

MS-012AA

JESD-30 Code:

R-PDSO-G8

Non Repetitive Peak On-state Current:

4.3 A

No. of Elements:

3

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Reference Standard:

UL RECOGNIZED

Sub-Category:

Silicon Surge Protectors

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Device Type:

Trade Compliance

TISP7350F3D Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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