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TISP4300H3LMFR

Texas Instruments

TISP4300H3LMFR by Texas Instruments

TISP4300H3LMFR by Texas Instruments is a single silicon surge protector with a non-repetitive peak on-state current of 60A. It operates b/w -40°C to 150°C, offering protection up to 230V DC off-state voltage. Ideal for applications requiring reliable overvoltage protection using thyristor surge protector technology.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,268 parts In-Stock

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5,268

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Digiode

USA . 466 parts In-Stock

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466

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 287 parts In-Stock

1+ parts

$2.229

100+ parts

-

1k+ parts

$2.733

10k+ parts

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287

$2.229

-

$2.733

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ChromeModa Solutions

Germany . 5,713 parts In-Stock

1+ parts

$2.504

100+ parts

$2.053

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5,713

$2.504

$2.053

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IDEA Electronic Components Group

UK . 991 parts In-Stock

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$2.504

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-

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$2.254

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991

$2.504

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$2.254

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AZTECH Wire

Italy . 531 parts In-Stock

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$5.418

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531

$5.418

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One Stop Electronics

USA . 1,302 parts In-Stock

1+ parts

$6.100

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1,302

$6.100

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Ampacity Inc.

Singapore . 1,193 parts In-Stock

1+ parts

$6.100

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1,193

$6.100

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Semicontronic

India . 846 parts In-Stock

1+ parts

$28.100

100+ parts

$27.398

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$27.257

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846

$28.100

$27.398

$27.257

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DigiPath Technology Company

USA . 1,292 parts In-Stock

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$2.258

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1,292

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$2.258

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Corphita

USA . 401 parts In-Stock

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401

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Corohmni

South Africa . 155 parts In-Stock

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155

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Overview

Protect your electronics with the TISP4300H3LMFR by Texas Instruments, a top-of-the-line Silicon Surge Protector that offers unmatched quality and reliability. Manufactured by industry leader Texas Instruments, this surge protector is designed to safeguard your devices from power surges and voltage spikes. With a non-repetitive peak on-state current of 60 A and a maximum breakdown voltage of 300 V, this single-terminal device provides the ultimate protection for your valuable equipment. Trust Texas Instruments to deliver superior performance and peace of mind.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body enhances durability and resistance to environmental factors, making this surge protector suitable for long-term use.

Non Repetitive Peak On-state Current: 60 A

With a high non repetitive peak on-state current of 60 A, this surge protector can effectively handle sudden surges in electricity flow, providing reliable protection to connected devices.

Package Shape: ROUND

The round package shape offers compactness and ease of installation in various settings, making it convenient to integrate this surge protector into different systems.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature of 150°C ensures reliable performance even in demanding thermal conditions, making this surge protector suitable for a wide range of applications.

Trigger Device Type: THYRISTOR SURGE PROTECTOR

The use of thyristor surge protector as the trigger device ensures quick and efficient response to surge events, providing enhanced protection to connected equipment.

Technical Specifications

Silicon Surge Protectors TISP4300H3LMFR attributes and parameters. Explore more Silicon Surge Protectors devices from Texas Instruments

Specs

Maximum Breakdown Voltage:

300 V

Configuration:

Maximum DC Off-state Voltage:

230 V

Maximum Holding Current:

600 mA

JESD-30 Code:

O-PBCY-T2

Non Repetitive Peak On-state Current:

60 A

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Sub-Category:

Silicon Surge Protectors

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Device Type:

Trade Compliance

TISP4300H3LMFR Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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