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TIOL112DRCR

Texas Instruments

TIOL112DRCR by Texas Instruments

TIOL112DRCR by Texas Instruments is a small outline interface IC with 10 terminals. It operates b/w -40 to 125 °C and supports supply voltages from 7V to 36V. Ideal for applications requiring a max output peak current limit of 0.35A in a compact package.

Median Price

$3.520

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 755,589 parts In-Stock

1+ parts

$2.432

100+ parts

$2.131

1k+ parts

$1.204

10k+ parts

-

755,589

$2.432

$2.131

$1.204

-

Mouser Electronics

USA . 7,100 parts In-Stock

1+ parts

$3.520

100+ parts

$2.200

1k+ parts

$1.960

10k+ parts

$1.850

7,100

$3.520

$2.200

$1.960

$1.850

DigiKey

USA . 6,369 parts In-Stock

1+ parts

$3.520

100+ parts

$2.193

1k+ parts

$1.953

10k+ parts

$1.857

6,369

$3.520

$2.193

$1.953

$1.857

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,882 parts In-Stock

1+ parts

$2.310

100+ parts

-

1k+ parts

-

10k+ parts

-

1,882

$2.310

-

-

-

Vyrian

USA . 2,359 parts In-Stock

1+ parts

$2.432

100+ parts

-

1k+ parts

-

10k+ parts

-

2,359

$2.432

-

-

-

Kruse Electronics AG

Switzerland . 745,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

745,000

-

-

-

-

Kruse

Germany . 745,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

745,000

-

-

-

-

Cyclops Electronics Ltd

UK . 42,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

42,000

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 73 parts In-Stock

1+ parts

$2.189

100+ parts

-

1k+ parts

-

10k+ parts

-

73

$2.189

-

-

-

Parana Technologies

USA . 2,130 parts In-Stock

1+ parts

$7.108

100+ parts

-

1k+ parts

$7.628

10k+ parts

-

2,130

$7.108

-

$7.628

-

DigiPath Technology Company

USA . 1,707 parts In-Stock

1+ parts

$7.826

100+ parts

$7.200

1k+ parts

-

10k+ parts

-

1,707

$7.826

$7.200

-

-

ChromeModa Solutions

Germany . 3,574 parts In-Stock

1+ parts

$7.986

100+ parts

$6.549

1k+ parts

-

10k+ parts

-

3,574

$7.986

$6.549

-

-

IDEA Electronic Components Group

UK . 2,027 parts In-Stock

1+ parts

$7.986

100+ parts

-

1k+ parts

$7.187

10k+ parts

-

2,027

$7.986

-

$7.187

-

GlobX GmbH

Germany . 758,217 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

758,217

-

-

-

-

Lixinc

USA . 8,771 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,771

-

-

-

-

Overview

Discover the cutting-edge TIOL112DRCR by Texas Instruments, a top-tier manufacturer known for their superior quality products. This interface IC offers unmatched reliability and performance, making it ideal for a wide range of applications. From automotive to industrial, this product provides customers with exceptional value, benefits, and advantages. Say goodbye to compromise and hello to seamless functionality with the TIOL112DRCR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable and long-lasting applications.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation on PCBs, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 36 V

With a high maximum supply voltage, this product can be used in a wide range of voltage applications, providing flexibility and versatility.

Package Shape: SQUARE

The square package shape is compact and space-saving, making it suitable for applications where board real estate is limited.

No. of Terminals: 10

The high number of terminals allows for multiple connections and interfaces, enhancing the functionality and connectivity of the product.

Package Style: SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

The small outline, heat sink/slug, and very thin profile package style ensures efficient heat dissipation and space-saving design, making it suitable for compact applications.

Minimum Supply Voltage: 7 V

With a low minimum supply voltage, the product can operate effectively in low-power applications, saving energy and reducing costs.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature makes the product suitable for use in harsh environments with high temperature fluctuations, improving overall reliability.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the product to withstand cold temperatures, ensuring reliable performance even in extreme weather conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides corrosion resistance and ensures stable electrical connections, enhancing the longevity and reliability of the product.

Terminal Position: DUAL

The dual terminal position allows for dual connections, increasing the flexibility and functionality of the product in various applications.

Maximum Seated Height: 1 mm

The low maximum seated height makes the product suitable for slim and compact designs, saving space and enabling versatile integration.

Width: 3 mm

The compact width of the product enables tight PCB layouts, making it suitable for applications where space is limited.

Peak Reflow Temperature: 260

With a high peak reflow temperature, the product can withstand the reflow soldering process during assembly, ensuring proper soldering and reliable connections.

Length: 3 mm

The short length of the product allows for compact and space-saving designs, making it suitable for applications with size constraints.

Terminal Form: NO LEAD

The no-lead terminal form is environmentally friendly and compliant with RoHS regulations, making the product a sustainable and safe choice.

Nominal Supply Voltage: 24 V

The nominal supply voltage of 24V provides a common voltage option for various applications, simplifying integration and compatibility.

Terminal Pitch: 0.5 mm

The small terminal pitch allows for high-density mounting and compact PCB layouts, enabling efficient use of board space.

Moisture Sensitivity Level (MSL): 2

The moisture sensitivity level of 2 indicates that the product has moderate sensitivity to moisture, making it suitable for a wide range of environments and storage conditions.

Nominal Output Peak Current Limit: 0.35 A

The nominal output peak current limit of 0.35A ensures safe operation and protects the product from overcurrent conditions, improving overall reliability.

Interface IC Type: INTERFACE CIRCUIT

The interface circuit type indicates that the product is designed for interfacing with other components or systems, offering expanded connectivity and functionality.

Technical Specifications

Other Function Interface ICs TIOL112DRCR attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Interface IC Type:

JESD-30 Code:

S-PDSO-N10

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

10

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Peak Current Limit:

.35 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC10,.11,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

36 V

Minimum Supply Voltage:

7 V

Nominal Supply Voltage:

24 V

Surface Mount:

YES

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

3 mm

Trade Compliance

TIOL112DRCR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

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