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THS6092IDRG4

Texas Instruments

THS6092IDRG4 by Texas Instruments

THS6092IDRG4 by Texas Instruments is a Line Driver IC with 2 functions, operating at -40 to 85°C. It has a supply voltage range of 2.5V to 7V and comes in a small outline package suitable for industrial applications requiring differential input characteristics.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Digiode

USA . 4,056 parts In-Stock

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Vyrian

USA . 3,099 parts In-Stock

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One Stop Electronics

USA . 809 parts In-Stock

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$2.500

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809

$2.500

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AZTECH Wire

Italy . 466 parts In-Stock

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$8.559

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Parana Technologies

USA . 917 parts In-Stock

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$12.350

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$1,146.851

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$11.115

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917

$12.350

$1,146.851

$11.115

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DigiPath Technology Company

USA . 1,274 parts In-Stock

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$13.598

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$12.511

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$12.511

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ChromeModa Solutions

Germany . 1,987 parts In-Stock

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$13.876

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$11.378

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$13.876

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IDEA Electronic Components Group

UK . 1,406 parts In-Stock

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$13.876

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$13.182

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$12.488

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QUARKTWIN TECHNOLOGY LTD

USA . 8,653 parts In-Stock

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Corphita

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Microchip USA

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Overview

Enhance your electronic designs with the THS6092IDRG4 by Texas Instruments, a top-quality line driver and receiver that offers unmatched performance and reliability. Manufactured by the trusted brand Texas Instruments, this versatile component is ideal for a wide range of applications. From industrial automation to telecommunications, this product provides value and benefits that will take your projects to the next level. Trust Texas Instruments to deliver cutting-edge technology that exceeds expectations. Elevate your designs with the THS6092IDRG4 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 7 V

Can accommodate a wide range of input voltages, making it versatile for various applications.

No. of Functions: 2

Offers multiple functions in a single package, reducing the need for additional components and simplifying the design.

Package Shape: RECTANGULAR

Space-efficient design that can fit into compact layouts, maximizing board space usage.

Power Supplies (V): 12

Supports higher power requirements, suitable for applications that demand more power output.

No. of Terminals: 8

Provides multiple connection points for versatile connectivity options in the circuit.

Minimum Supply Voltage: 2.5 V

Operates efficiently even at low voltages, ensuring compatibility with various power sources.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, suitable for industrial environments where heat may be a concern.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme cold conditions, making it suitable for a wide range of environments.

Terminal Position: DUAL

Provides redundancy for more reliable connections and improved signal integrity.

Maximum Seated Height: 1.75 mm

Low profile design that saves space and enables installation in compact devices or tight spaces.

Width: 3.9 mm

Compact size that allows for dense packing on circuit boards, ideal for applications with limited space.

Length: 4.9 mm

Compact dimensions for easy integration in small electronic devices or tight layouts.

Temperature Grade: INDUSTRIAL

Designed to meet industrial temperature standards, ensuring reliability in harsh operating conditions.

Maximum Receive Delay: 0 ns

Instantaneous signal reception and processing, ideal for real-time applications that require minimal delay.

Terminal Form: GULL WING

Enhances solderability and mechanical strength, ensuring secure connections on the circuit board.

Input Characteristics: DIFFERENTIAL

Provides noise rejection and better signal quality, suitable for high-speed data transmission applications.

Nominal Supply Voltage: 5 V

Stable voltage supply for consistent performance, suitable for a wide range of applications.

Nominal Negative Supply Voltage: -5 V

Supports bipolar power supplies, enabling versatile operation in different power configurations.

Terminal Pitch: 1.27 mm

Standard pitch size for easy integration with other components on the circuit board.

Driver No. of Bits: 2

Suitable for applications that require binary signal processing, providing precise control and data transmission.

Interface IC Type: LINE DRIVER

Specifically designed for driving communication lines, ensuring reliable and efficient data transmission.

Technical Specifications

Line Drivers & Receivers THS6092IDRG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 5V TO 14V SINGLE SUPPLY

Differential Output:

NO

Driver No. of Bits:

2

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

2

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

12

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Maximum Seated Height:

1.75 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Voltage:

7 V

Minimum Supply Voltage:

2.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

THS6092IDRG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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