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THS3201DBVRG4

Texas Instruments

THS3201DBVRG4 by Texas Instruments

THS3201DBVRG4 by Texas Instruments is a small outline video amplifier with 5 terminals. It operates b/w -40 to 85°C, with a bandwidth of 1800 kHz. Ideal for audio/video applications requiring a supply voltage range of 3.3V to 7.5V in industrial settings.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,265 parts In-Stock

1+ parts

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4,265

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Vyrian

USA . 3,463 parts In-Stock

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3,463

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 51 parts In-Stock

1+ parts

$3.170

100+ parts

-

1k+ parts

$3.692

10k+ parts

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51

$3.170

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$3.692

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DigiPath Technology Company

USA . 90 parts In-Stock

1+ parts

$3.491

100+ parts

-

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90

$3.491

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ChromeModa Solutions

Germany . 5,980 parts In-Stock

1+ parts

$3.562

100+ parts

$2.921

1k+ parts

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5,980

$3.562

$2.921

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IDEA Electronic Components Group

UK . 557 parts In-Stock

1+ parts

$3.562

100+ parts

-

1k+ parts

$3.206

10k+ parts

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557

$3.562

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$3.206

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AZTECH Wire

Italy . 713 parts In-Stock

1+ parts

$7.056

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713

$7.056

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One Stop Electronics

USA . 765 parts In-Stock

1+ parts

$15.800

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765

$15.800

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Corphita

USA . 4,934 parts In-Stock

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4,934

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Microchip USA

USA . 2,546 parts In-Stock

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2,546

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Overview

Looking to enhance your audio and video experience? Look no further than the THS3201DBVRG4 by Texas Instruments. With a reputation for high-quality products, Texas Instruments delivers again with this video amplifier. Perfect for a wide range of applications, this small outline, low profile package offers customers exceptional value and performance. Upgrade your audio and video devices with the THS3201DBVRG4 and enjoy superior quality and reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and resistant to damage.

Surface Mount: YES

Being surface mountable makes installation and integration of the amplifier convenient and space-efficient.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of space and easy placement on circuit boards.

General IC Type: VIDEO AMPLIFIER

Designed specifically for video amplification, ensuring high-quality video output.

No. of Terminals: 5

Sufficient number of terminals for connecting various components without overcomplicating the wiring.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Compact design with low profile makes it suitable for applications where space is limited.

Maximum Operating Temperature: 85 °C

Can operate at high temperatures without risk of damage, ensuring reliability in different environments.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme cold conditions, making it versatile for various applications.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides excellent conductivity and corrosion resistance for reliable connections.

Terminal Position: DUAL

Dual terminal position allows for flexible mounting options and ease of connection.

Maximum Seated Height: 1.45 mm

Low profile design makes it suitable for compact devices and PCB layouts with height constraints.

Width: 1.6 mm

Slim width allows for space-efficient placement on circuit boards.

Minimum Supply Voltage (Vsup): 3.3 V

Low minimum supply voltage ensures compatibility with a wide range of power sources.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for a sufficient amount of time during manufacturing processes.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance for reliable soldering during assembly.

Length: 2.9 mm

Compact length for efficient use of space on a circuit board.

Temperature Grade: INDUSTRIAL

Suitable for industrial applications with varying temperature conditions.

Nominal Bandwidth: 1800 kHz

High bandwidth for optimal video signal amplification and clarity.

Terminal Form: GULL WING

Gull wing terminals provide strong mechanical support and ensure secure connections.

Terminal Pitch: 0.95 mm

Close terminal pitch for compact design and efficient routing of signals.

Maximum Supply Voltage (Vsup): 7.5 V

Sufficient maximum supply voltage for powering the amplifier and supporting high-quality video output.

Technical Specifications

Audio & Video Amplifiers THS3201DBVRG4 attributes and parameters. Explore more Audio & Video Amplifiers devices from Texas Instruments

Specs

Additional Features:

IT CAN ALSO OPERATE WITH 6.6V TO 15V SINGLE SUPPLY

Nominal Bandwidth:

1800 kHz

General IC Type:

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

5

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.45 mm

Maximum Supply Voltage (Vsup):

7.5 V

Minimum Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.6 mm

Trade Compliance

THS3201DBVRG4 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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