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THS3121CDGN

Texas Instruments

THS3121CDGN by Texas Instruments

THS3121CDGN by Texas Instruments is a video amplifier with 8 terminals and a bandwidth of 130 kHz. It operates b/w 0-70°C, with supply voltage ranging from 5-15V. This small outline package is ideal for audio/video applications requiring high performance in a compact design.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,816 parts In-Stock

1+ parts

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7,816

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Digiode

USA . 4,602 parts In-Stock

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4,602

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,251 parts In-Stock

1+ parts

$3.482

100+ parts

-

1k+ parts

$4.006

10k+ parts

-

2,251

$3.482

-

$4.006

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DigiPath Technology Company

USA . 1,782 parts In-Stock

1+ parts

$3.834

100+ parts

$3.527

1k+ parts

-

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1,782

$3.834

$3.527

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ChromeModa Solutions

Germany . 6,908 parts In-Stock

1+ parts

$3.912

100+ parts

$3.208

1k+ parts

-

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6,908

$3.912

$3.208

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IDEA Electronic Components Group

UK . 1,428 parts In-Stock

1+ parts

$3.912

100+ parts

-

1k+ parts

$3.521

10k+ parts

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1,428

$3.912

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$3.521

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AZTECH Wire

Italy . 704 parts In-Stock

1+ parts

$10.329

100+ parts

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704

$10.329

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One Stop Electronics

USA . 866 parts In-Stock

1+ parts

$18.800

100+ parts

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866

$18.800

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Microchip USA

USA . 4,142 parts In-Stock

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4,142

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Corphita

USA . 774 parts In-Stock

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774

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Overview

Enhance your audio and video amplification projects with the THS3121CDGN by Texas Instruments. Known for their superior quality and reliability, Texas Instruments delivers cutting-edge technology in a compact square package. Whether you're working on home entertainment systems, professional audio equipment, or automotive applications, this video amplifier offers unmatched performance and precision. Elevate your projects with the industry-leading features and benefits of the THS3121CDGN, making it the perfect choice for all your amplification needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides good protection for the internal components of the amplifier, ensuring durability and reliability.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation of the amplifier on circuit boards, saving space and making it suitable for compact designs.

General IC Type: VIDEO AMPLIFIER

Designed specifically for video signals, this amplifier is optimized for providing high-quality video output, making it ideal for video applications.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this amplifier can withstand elevated temperatures, ensuring stable performance in various operating conditions.

Minimum Supply Voltage (Vsup): 5 V

The low minimum supply voltage requirement of 5V enables this amplifier to be used in a wide range of systems, including those with lower power capabilities.

Technical Specifications

Audio & Video Amplifiers THS3121CDGN attributes and parameters. Explore more Audio & Video Amplifiers devices from Texas Instruments

Specs

Additional Features:

IT CAN ALSO OPERATE WITH 10V TO 30V SINGLE SUPPLY

Nominal Bandwidth:

130 kHz

General IC Type:

JESD-30 Code:

S-PDSO-G8

Length:

3 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

1.07 mm

Maximum Supply Voltage (Vsup):

15 V

Minimum Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3 mm

Trade Compliance

THS3121CDGN General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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