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THS3115CDRG4

Texas Instruments

THS3115CDRG4 by Texas Instruments

THS3115CDRG4 by Texas Instruments is a video amplifier IC with 2 functions, operating b/w 0-70°C. It has a bandwidth of 110 kHz, suitable for audio & video applications. This small outline package IC requires a supply voltage of 5-15V and is surface mountable.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,352 parts In-Stock

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7,352

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Digiode

USA . 937 parts In-Stock

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937

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 768 parts In-Stock

1+ parts

$1.153

100+ parts

-

1k+ parts

$1.967

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768

$1.153

-

$1.967

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ChromeModa Solutions

Germany . 5,768 parts In-Stock

1+ parts

$1.296

100+ parts

$1.063

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5,768

$1.296

$1.063

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IDEA Electronic Components Group

UK . 1,005 parts In-Stock

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$1.296

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$1.166

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1,005

$1.296

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$1.166

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AZTECH Wire

Italy . 255 parts In-Stock

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$7.567

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255

$7.567

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One Stop Electronics

USA . 480 parts In-Stock

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$10.800

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480

$10.800

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Component Stockers USA

USA . 492 parts In-Stock

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$99.990

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492

$99.990

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Corphita

USA . 3,975 parts In-Stock

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DigiPath Technology Company

USA . 2,008 parts In-Stock

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$1.168

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2,008

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$1.168

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Microchip USA

USA . 215 parts In-Stock

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215

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Overview

Elevate your audio and video experience with the THS3115CDRG4 by Texas Instruments. Known for their superior quality and cutting-edge technology, Texas Instruments brings you a top-of-the-line video amplifier that delivers unparalleled performance and reliability. Perfect for a wide range of applications, this amplifier is designed to enhance your audio and video systems with crystal-clear clarity and precision. Trust Texas Instruments to provide you with the best in class products that exceed your expectations. Experience the difference with the THS3115CDRG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for various applications.

Surface Mount: YES

The surface mount feature allows for easy installation on PCBs, saving space and reducing assembly time.

No. of Functions: 2

Having 2 functions in one device provides versatility and efficiency in audio and video amplification.

Package Shape: RECTANGULAR

The rectangular package shape enables easy integration into circuit designs and saves space on the PCB.

General IC Type: VIDEO AMPLIFIER

Being a video amplifier IC ensures high-quality video signal amplification for a clear and crisp display.

No. of Terminals: 14

Having 14 terminals allows for multiple connection options and flexibility in circuit designs.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves PCB real estate and is ideal for compact electronic devices.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures reliability and performance in various environmental conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures the device can function in cold environments without any issues.

Terminal Position: DUAL

Having dual terminal positions allows for versatile PCB layout options and ease of connectivity.

Maximum Seated Height: 1.75 mm

The low maximum seated height helps in keeping the overall profile of the device slim and compact.

Width: 3.9 mm

The narrow width of the device saves space on the PCB and provides ease of integration into tight layouts.

Minimum Supply Voltage (Vsup): 5 V

The low minimum supply voltage ensures compatibility with a wide range of power sources.

Length: 8.65 mm

The compact length of the device contributes to space-saving on the PCB and allows for efficient circuit designs.

Temperature Grade: COMMERCIAL

The commercial temperature grade ensures reliable operation in standard temperature conditions.

Nominal Bandwidth: 110 kHz

The high nominal bandwidth enables the device to handle a wide range of audio and video frequencies for clear signal amplification.

Terminal Form: GULL WING

The gull wing terminal form provides secure and reliable connections to the PCB for stable operation.

Terminal Pitch: 1.27 mm

The small terminal pitch allows for compact terminal spacing on the PCB, saving space and enabling high-density designs.

Maximum Supply Voltage (Vsup): 15 V

The high maximum supply voltage ensures compatibility with various power sources for versatile application scenarios.

Technical Specifications

Audio & Video Amplifiers THS3115CDRG4 attributes and parameters. Explore more Audio & Video Amplifiers devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES WITH 10 TO 30V SINGLE SUPPLY

Nominal Bandwidth:

110 kHz

General IC Type:

JESD-30 Code:

R-PDSO-G14

Length:

8.65 mm

No. of Channels:

1

No. of Functions:

2

No. of Terminals:

14

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

15 V

Minimum Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

THS3115CDRG4 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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