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TDP142RNQT

Texas Instruments

TDP142RNQT by Texas Instruments

TDP142RNQT by Texas Instruments is a 40-terminal consumer IC with a package style of chip carrier. It operates b/w 0-70°C, suitable for commercial applications. With 4 channels and a terminal pitch of 0.4mm, it's ideal for compact electronic devices requiring low supply voltage.

Median Price

$5.125

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 26,598 parts In-Stock

1+ parts

$3.886

100+ parts

$3.168

1k+ parts

$2.112

10k+ parts

-

26,598

$3.886

$3.168

$2.112

-

Farnell

UK . 146 parts In-Stock

1+ parts

$4.420

100+ parts

$3.150

1k+ parts

-

10k+ parts

-

146

$4.420

$3.150

-

-

DigiKey

USA . 1,265 parts In-Stock

1+ parts

$5.830

100+ parts

$3.751

1k+ parts

$3.410

10k+ parts

$3.282

1,265

$5.830

$3.751

$3.410

$3.282

Mouser Electronics

USA . 452 parts In-Stock

1+ parts

$5.830

100+ parts

$3.760

1k+ parts

$3.310

10k+ parts

-

452

$5.830

$3.760

$3.310

-

Element14

Singapore . 146 parts In-Stock

1+ parts

$9.070

100+ parts

$6.800

1k+ parts

$5.150

10k+ parts

$4.960

146

$9.070

$6.800

$5.150

$4.960

Avnet

USA . 250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.607

10k+ parts

$3.390

250

-

-

$3.607

$3.390

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,994 parts In-Stock

1+ parts

$3.692

100+ parts

-

1k+ parts

-

10k+ parts

-

4,994

$3.692

-

-

-

Vyrian

USA . 2,346 parts In-Stock

1+ parts

$3.886

100+ parts

-

1k+ parts

-

10k+ parts

-

2,346

$3.886

-

-

-

Chip Stock

USA . 7,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,000

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,735 parts In-Stock

1+ parts

$2.894

100+ parts

-

1k+ parts

$3.388

10k+ parts

-

1,735

$2.894

-

$3.388

-

DigiPath Technology Company

USA . 1,422 parts In-Stock

1+ parts

$3.187

100+ parts

-

1k+ parts

-

10k+ parts

-

1,422

$3.187

-

-

-

ChromeModa Solutions

Germany . 2,924 parts In-Stock

1+ parts

$3.252

100+ parts

$2.667

1k+ parts

-

10k+ parts

-

2,924

$3.252

$2.667

-

-

IDEA Electronic Components Group

UK . 2,102 parts In-Stock

1+ parts

$3.252

100+ parts

-

1k+ parts

$2.927

10k+ parts

-

2,102

$3.252

-

$2.927

-

Corphita

USA . 3,659 parts In-Stock

1+ parts

$3.497

100+ parts

-

1k+ parts

-

10k+ parts

-

3,659

$3.497

-

-

-

Component Stockers USA

USA . 4,086 parts In-Stock

1+ parts

$5.590

100+ parts

$4.110

1k+ parts

$2.790

10k+ parts

-

4,086

$5.590

$4.110

$2.790

-

Overview

Discover the ultimate solution for all your consumer circuit needs with the TDP142RNQT by Texas Instruments. Crafted with precision and expertise, this high-quality chip carrier offers unmatched performance and reliability. Whether you're working on home appliances or electronic gadgets, this very thin profile IC ensures seamless operation and efficiency. With a wide temperature range and innovative terminal finish, the TDP142RNQT guarantees longevity and durability. Upgrade your projects today with this top-of-the-line consumer IC from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and protection for the internal circuitry, making this product reliable for long-term use.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Package Shape: RECTANGULAR

The rectangular package shape offers a compact design that can easily fit into various electronic devices, maximizing space efficiency.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this product can withstand high temperatures, ensuring stable performance in different environments.

Minimum Operating Temperature: 0 °C

The ability to operate at temperatures as low as 0°C makes this product suitable for a wide range of applications, including those in colder environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable connections and signal transmission.

Width: 4 mm

With a width of 4mm, this product offers a compact form factor that is ideal for applications where space is limited.

Minimum Supply Voltage (Vsup): 3 V

The low minimum supply voltage of 3V enables this product to operate efficiently while consuming less power, reducing energy costs.

Temperature Grade: COMMERCIAL

Designed for commercial use, this product meets industry standards for reliability and performance, making it a suitable choice for various consumer electronics.

No. of Channels: 4

With 4 channels, this product offers versatility in signal processing and control, allowing for multiple functions to be performed simultaneously.

Technical Specifications

Other Function Consumer ICs TDP142RNQT attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

R-PQCC-N40

JESD-609 Code:

e4

Length:

6 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

4

No. of Functions:

1

No. of Terminals:

40

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.8 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Trade Compliance

TDP142RNQT General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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