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TCAN337D

Texas Instruments

TCAN337D by Texas Instruments

TCAN337D by Texas Instruments is an automotive-grade network interface IC with 1Mbps data rate. It operates b/w -40 to 125°C, ideal for harsh environments. With a small outline package and gull wing terminals, it's suitable for telecom interface circuits.

Median Price

$3.025

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 3,183 parts In-Stock

1+ parts

$2.200

100+ parts

$1.817

1k+ parts

$0.982

10k+ parts

-

3,183

$2.200

$1.817

$0.982

-

Mouser Electronics

USA . 566 parts In-Stock

1+ parts

$3.850

100+ parts

$1.970

1k+ parts

$1.540

10k+ parts

$1.350

566

$3.850

$1.970

$1.540

$1.350

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$1.951

100+ parts

-

1k+ parts

-

10k+ parts

-

10

$1.951

-

-

-

Digiode

USA . 3,525 parts In-Stock

1+ parts

$2.090

100+ parts

-

1k+ parts

-

10k+ parts

-

3,525

$2.090

-

-

-

Vyrian

USA . 8,950 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,950

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 1,720 parts In-Stock

1+ parts

$1.870

100+ parts

$1.823

1k+ parts

$1.814

10k+ parts

-

1,720

$1.870

$1.823

$1.814

-

Ampacity Inc.

Singapore . 1,459 parts In-Stock

1+ parts

$1.870

100+ parts

-

1k+ parts

-

10k+ parts

-

1,459

$1.870

-

-

-

Continental Prestige Electronics

USA . 5,407 parts In-Stock

1+ parts

$1.951

100+ parts

-

1k+ parts

-

10k+ parts

$1.912

5,407

$1.951

-

-

$1.912

Argo Parts USA

USA . 3,363 parts In-Stock

1+ parts

$1.951

100+ parts

-

1k+ parts

-

10k+ parts

-

3,363

$1.951

-

-

-

Corphita

USA . 3,609 parts In-Stock

1+ parts

$1.980

100+ parts

-

1k+ parts

-

10k+ parts

-

3,609

$1.980

-

-

-

Corohmni

South Africa . 272 parts In-Stock

1+ parts

$8.169

100+ parts

-

1k+ parts

-

10k+ parts

-

272

$8.169

-

-

-

Parana Technologies

USA . 1,987 parts In-Stock

1+ parts

$14.589

100+ parts

$1,354.799

1k+ parts

$13.130

10k+ parts

-

1,987

$14.589

$1,354.799

$13.130

-

DigiPath Technology Company

USA . 1,808 parts In-Stock

1+ parts

$16.064

100+ parts

-

1k+ parts

-

10k+ parts

-

1,808

$16.064

-

-

-

IDEA Electronic Components Group

UK . 2,084 parts In-Stock

1+ parts

$16.392

100+ parts

$15.572

1k+ parts

$14.753

10k+ parts

-

2,084

$16.392

$15.572

$14.753

-

ChromeModa Solutions

Germany . 2,082 parts In-Stock

1+ parts

$16.392

100+ parts

$13.441

1k+ parts

-

10k+ parts

-

2,082

$16.392

$13.441

-

-

Lixinc

USA . 7,615 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,615

-

-

-

-

Netroflash

USA . 50 parts In-Stock

1+ parts

-

100+ parts

$1.912

1k+ parts

$1.853

10k+ parts

$1.814

50

-

$1.912

$1.853

$1.814

Overview

Experience the superior quality and reliability of Texas Instruments with the TCAN337D Network Interface. This small outline package offers a range of applications in the automotive industry, providing seamless connectivity with a nominal supply voltage of 3.3V and data rate of 1Mbps. With Texas Instruments leading the way in innovative technology, you can trust in the performance and efficiency of the TCAN337D for all your networking needs. Upgrade your systems today and discover the value this product brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes this product lightweight and durable, ideal for portable networking devices.

Surface Mount: YES

The surface mount feature allows for easy and convenient installation on circuit boards, saving time and effort during assembly.

No. of Terminals: 8

With 8 terminals, this network interface provides ample connectivity options for various networking needs.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliable performance even in extreme heat conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance for long-lasting use.

Width: 3.9 mm

The compact width of 3.9 mm allows for space-saving integration in tight electronic setups.

Temperature Grade: AUTOMOTIVE

The automotive-grade temperature rating ensures this interface can withstand harsh conditions typically found in vehicles.

Nominal Supply Voltage: 3.3 V

The 3.3V supply voltage is a common standard, making this interface compatible with a wide range of devices and systems.

Technical Specifications

Network Interfaces TCAN337D attributes and parameters. Explore more Network Interfaces devices from Texas Instruments

Specs

Data Rate:

1 Mbps

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.75 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

TCAN337D Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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