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TCAN1051HDRBTQ1

Texas Instruments

TCAN1051HDRBTQ1 by Texas Instruments

TCAN1051HDRBTQ1 by Texas Instruments is a network interface IC with AEC-Q100 screening. It operates b/w -55 to 125 °C and supports a data rate of 2 Mbps. Ideal for automotive applications due to its MILITARY temperature grade and small outline package style.

Median Price

$2.230

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 9,517 parts In-Stock

1+ parts

$1.620

100+ parts

$1.338

1k+ parts

$0.723

10k+ parts

-

9,517

$1.620

$1.338

$0.723

-

DigiKey

USA . 500 parts In-Stock

1+ parts

$2.230

100+ parts

$1.348

1k+ parts

$1.204

10k+ parts

$1.118

500

$2.230

$1.348

$1.204

$1.118

Mouser Electronics

USA . 500 parts In-Stock

1+ parts

$2.230

100+ parts

$1.350

1k+ parts

$1.160

10k+ parts

$1.110

500

$2.230

$1.350

$1.160

$1.110

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 870 parts In-Stock

1+ parts

$1.341

100+ parts

-

1k+ parts

-

10k+ parts

-

870

$1.341

-

-

-

Digiode

USA . 3,197 parts In-Stock

1+ parts

$1.539

100+ parts

-

1k+ parts

-

10k+ parts

-

3,197

$1.539

-

-

-

Chip Stock

USA . 9,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

9,000

-

-

-

-

Vyrian

USA . 8,994 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,994

-

-

-

-

LWI Electronics Inc

India . 5 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 77 parts In-Stock

1+ parts

$1.110

100+ parts

-

1k+ parts

-

10k+ parts

-

77

$1.110

-

-

-

Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$1.143

100+ parts

$1.086

1k+ parts

$1.086

10k+ parts

-

500

$1.143

$1.086

$1.086

-

Continental Prestige Electronics

USA . 2,203 parts In-Stock

1+ parts

$1.341

100+ parts

-

1k+ parts

-

10k+ parts

$1.314

2,203

$1.341

-

-

$1.314

Netroflash

USA . 500 parts In-Stock

1+ parts

$1.341

100+ parts

-

1k+ parts

$1.274

10k+ parts

$1.247

500

$1.341

-

$1.274

$1.247

Argo Parts USA

USA . 379 parts In-Stock

1+ parts

$1.341

100+ parts

-

1k+ parts

-

10k+ parts

-

379

$1.341

-

-

-

Semicontronic

India . 3,353 parts In-Stock

1+ parts

$1.380

100+ parts

$1.346

1k+ parts

$1.339

10k+ parts

-

3,353

$1.380

$1.346

$1.339

-

Ampacity Inc.

Singapore . 3,049 parts In-Stock

1+ parts

$1.380

100+ parts

-

1k+ parts

-

10k+ parts

-

3,049

$1.380

-

-

-

Corphita

USA . 3,760 parts In-Stock

1+ parts

$1.458

100+ parts

-

1k+ parts

-

10k+ parts

-

3,760

$1.458

-

-

-

Parana Technologies

USA . 1,933 parts In-Stock

1+ parts

$8.512

100+ parts

-

1k+ parts

$9.169

10k+ parts

-

1,933

$8.512

-

$9.169

-

ChromeModa Solutions

Germany . 1,345 parts In-Stock

1+ parts

$9.564

100+ parts

$7.842

1k+ parts

-

10k+ parts

-

1,345

$9.564

$7.842

-

-

IDEA Electronic Components Group

UK . 93 parts In-Stock

1+ parts

$9.564

100+ parts

$9.086

1k+ parts

$8.608

10k+ parts

-

93

$9.564

$9.086

$8.608

-

A-Z Elektronik GmbH

Germany . 5,652 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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5,652

-

-

-

-

Futuretech Components

Singapore . 1,750 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,750

-

-

-

-

DigiPath Technology Company

USA . 16 parts In-Stock

1+ parts

-

100+ parts

$8.623

1k+ parts

-

10k+ parts

-

16

-

$8.623

-

-

Overview

Experience the top-tier quality and reliability of Texas Instruments with the TCAN1051HDRBTQ1 network interface. Designed for a range of applications, this interface provides unmatched value and performance. With a MILITARY temperature grade and AEC-Q100 screening level, you can trust in the durability and longevity of this product. Whether you're looking to enhance your telecom systems or improve your network connectivity, the TCAN1051HDRBTQ1 offers the advantages you need to stay ahead in today's fast-paced world.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLastic/Epoxy material is lightweight and durable, making this product ideal for portable or rugged applications.

Surface Mount: YES

Surface mount installation saves space on the PCB and allows for efficient assembly.

Screening Level: AEC-Q100

AEC-Q100 screening ensures high reliability and quality standards, perfect for automotive applications.

Package Shape: SQUARE

Square package shape is easy to handle and provides a stable mounting surface on the PCB.

No. of Terminals: 8

Having 8 terminals allows for multiple connections and functionality in a compact design.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature ensures the product can function in cold climates or environments.

Terminal Finish: MATTE TIN

Matte tin finish provides good conductivity and solderability for reliable connections.

Terminal Position: DUAL

Dual terminal position allows for flexibility in PCB layout and connection options.

Maximum Seated Height: 1 mm

Low seated height saves space on the PCB and allows for slim device designs.

Width: 3 mm

Compact width makes this product suitable for applications with limited space.

Maximum Time At Peak Reflow Temperature (s): 30

Short reflow time ensures quick and efficient manufacturing processes.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures proper soldering and reliability in the assembly process.

Length: 3 mm

Compact length makes this product suitable for space-constrained applications.

Temperature Grade: MILITARY

Military-grade temperature range ensures the product can operate in extreme conditions.

Terminal Form: NO LEAD

No lead terminal form is environmentally friendly and compliant with RoHS regulations.

Maximum Supply Current: 180 mA

High supply current capacity allows for reliable performance under load.

Telecom IC Type: INTERFACE CIRCUIT

Interface circuit type is suitable for telecom applications requiring data transmission.

Nominal Supply Voltage: 5 V

Stable 5V supply voltage ensures consistent operation of the product.

Terminal Pitch: 0.65 mm

Narrow terminal pitch allows for high-density PCB designs and efficient use of space.

Data Rate: 2 Mbps

High data rate of 2 Mbps enables fast and efficient data transmission for networking applications.

Technical Specifications

Network Interfaces TCAN1051HDRBTQ1 attributes and parameters. Explore more Network Interfaces devices from Texas Instruments

Specs

Data Rate:

2 Mbps

JESD-30 Code:

S-PDSO-N8

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

No. of Transceivers:

1

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

1 mm

Maximum Supply Current:

180 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

TCAN1051HDRBTQ1 Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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