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TB3R2LD

Texas Instruments

TB3R2LD by Texas Instruments

TB3R2LD by Texas Instruments is a 16-terminal line driver with CMOS technology, operating at 3.3V. It features 4 functions, differential output, and a max supply current of 34mA. Ideal for industrial applications requiring fast response times and reliable signal transmission over short distances.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,313 parts In-Stock

1+ parts

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5,313

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Digiode

USA . 3,320 parts In-Stock

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3,320

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,335 parts In-Stock

1+ parts

$5.498

100+ parts

-

1k+ parts

$6.237

10k+ parts

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2,335

$5.498

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$6.237

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DigiPath Technology Company

USA . 2,009 parts In-Stock

1+ parts

$6.053

100+ parts

$5.569

1k+ parts

-

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2,009

$6.053

$5.569

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ChromeModa Solutions

Germany . 3,444 parts In-Stock

1+ parts

$6.177

100+ parts

$5.065

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3,444

$6.177

$5.065

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IDEA Electronic Components Group

UK . 747 parts In-Stock

1+ parts

$6.177

100+ parts

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$5.559

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747

$6.177

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$5.559

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AZTECH Wire

Italy . 442 parts In-Stock

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$16.909

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442

$16.909

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One Stop Electronics

USA . 1,390 parts In-Stock

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$17.500

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1,390

$17.500

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Corphita

USA . 1,820 parts In-Stock

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Overview

Unlock seamless communication and unparalleled performance with the Texas Instruments TB3R2LD Line Drivers & Receivers. Crafted with precision by a trusted manufacturer, this small outline package offers 4 functions to elevate your industrial applications. With a maximum supply voltage of 3.6V and differential output, this technology ensures reliable data transmission at peak efficiency. Experience the value of superior quality and cutting-edge innovation in every terminal, providing a seamless solution for all your connectivity needs. Elevate your projects with the TB3R2LD today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and long-lasting.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage enables compatibility with a wide range of systems.

No. of Functions: 4

Having multiple functions in a single device reduces the need for additional components and simplifies the design.

Package Shape: RECTANGULAR

The rectangular shape is space-efficient and fits well on circuit boards.

Power Supplies (V): 3.3

The specified power supply voltage ensures stable and reliable performance.

No. of Terminals: 16

The high number of terminals allows for versatile connectivity options.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the circuit board.

Minimum Supply Voltage: 3 V

The low minimum supply voltage helps in reducing power consumption.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance in a variety of environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for use in extreme cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

This finish provides excellent conductivity and corrosion resistance for long-term reliability.

Terminal Position: DUAL

Dual terminal positions offer flexibility in installation and connection options.

Maximum Seated Height: 1.75 mm

The low seated height is ideal for applications with space constraints.

Width: 3.9 mm

The narrow width saves space and allows for compact designs.

Maximum Output Low Current: 8 Amp

The high output current capability supports robust signal transmission.

Receiver No. of Bits: 4

The 4-bit receiver allows for accurate data transmission.

Differential Output: YES

Differential outputs help in eliminating noise and interference for clearer signals.

Maximum Time At Peak Reflow Temperature (s): 30

This ensures proper soldering during manufacturing processes.

Peak Reflow Temperature °C: 250

The high peak reflow temperature ensures secure solder joints.

Length: 9.9 mm

The compact length allows for easy integration into circuit designs.

Temperature Grade: INDUSTRIAL

The industrial-grade temperature rating ensures reliable performance in harsh operating conditions.

Maximum Receive Delay: 4 ns

The low receive delay contributes to high-speed data transmission.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering and secure connections.

Maximum Supply Current: 34 mA

The low supply current helps in reducing power consumption.

Input Characteristics: DIFFERENTIAL SCHMITT TRIGGER

Differential Schmitt trigger inputs provide hysteresis for noise immunity and improved signal integrity.

Nominal Supply Voltage: 3.3 V

The specified nominal supply voltage ensures stable operation within the recommended range.

Terminal Pitch: 1.27 mm

The small terminal pitch allows for high-density mounting on circuit boards.

Moisture Sensitivity Level (MSL): 2

MSL 2 indicates that the product has a moderate level of moisture sensitivity, suitable for standard manufacturing processes.

Interface IC Type: LINE RECEIVER

The line receiver interface IC type enables seamless communication and data transfer.

Technical Specifications

Line Drivers & Receivers TB3R2LD attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Low Current:

8 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

250

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Receive Delay:

4 ns

Receiver No. of Bits:

4

Maximum Seated Height:

1.75 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

34 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

TB3R2LD Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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