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TB3R1DR

Texas Instruments

TB3R1DR by Texas Instruments

TB3R1DR by Texas Instruments is a 16-terminal line driver with 4 functions, operating at 3.3V. It features a CMOS technology, differential output, and nickel palladium gold terminal finish. Ideal for industrial applications requiring true output polarity and dual terminal position.

Median Price

$17.810

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 20,783 parts In-Stock

1+ parts

$17.810

100+ parts

$15.557

1k+ parts

$10.729

10k+ parts

-

20,783

$17.810

$15.557

$10.729

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,130 parts In-Stock

1+ parts

$16.920

100+ parts

-

1k+ parts

-

10k+ parts

-

1,130

$16.920

-

-

-

Vyrian

USA . 8,739 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,739

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 24 parts In-Stock

1+ parts

$12.245

100+ parts

$1,137.099

1k+ parts

$11.020

10k+ parts

-

24

$12.245

$1,137.099

$11.020

-

DigiPath Technology Company

USA . 952 parts In-Stock

1+ parts

$13.483

100+ parts

$12.404

1k+ parts

-

10k+ parts

-

952

$13.483

$12.404

-

-

ChromeModa Solutions

Germany . 1,628 parts In-Stock

1+ parts

$13.758

100+ parts

$11.282

1k+ parts

-

10k+ parts

-

1,628

$13.758

$11.282

-

-

IDEA Electronic Components Group

UK . 1,478 parts In-Stock

1+ parts

$13.758

100+ parts

$13.070

1k+ parts

$12.382

10k+ parts

-

1,478

$13.758

$13.070

$12.382

-

Corphita

USA . 1,467 parts In-Stock

1+ parts

$16.029

100+ parts

-

1k+ parts

-

10k+ parts

-

1,467

$16.029

-

-

-

AZTECH Wire

Italy . 1,152 parts In-Stock

1+ parts

$20.840

100+ parts

-

1k+ parts

-

10k+ parts

-

1,152

$20.840

-

-

-

Overview

Experience unmatched quality and reliability with the TB3R1DR by Texas Instruments, a leading manufacturer in the industry. This innovative line driver and receiver offers unparalleled performance and versatility in various applications. From industrial settings to consumer electronics, this product delivers exceptional value with its high efficiency and precision. Trust Texas Instruments to provide you with cutting-edge technology that exceeds expectations and enhances your projects. Choose the TB3R1DR for superior results every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a durable and lightweight housing for the components inside, ensuring reliability and ease of installation.

Maximum Supply Voltage: 3.6 V

Can handle high voltage inputs without getting damaged, making it versatile for various applications.

No. of Functions: 4

Provides multiple functions in a single device, saving space and reducing the need for additional components.

Maximum Operating Temperature: 85 °C

Can operate effectively in high temperature environments, increasing its suitability for industrial use.

Technology: CMOS

Uses CMOS technology which offers low power consumption and high noise immunity, making it efficient and reliable.

Technical Specifications

Line Drivers & Receivers TB3R1DR attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Low Current:

8 Amp

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

250

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Receive Delay:

4 ns

Receiver No. of Bits:

4

Maximum Seated Height:

1.75 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

34 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage-1:

3.6 V

Minimum Supply Voltage-1:

3 V

Nominal Supply Voltage-1:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

TB3R1DR Interface ICs trade compliance attributes, and parameters.

ECCN

5A991.B.1

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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