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TB3R1DE4

Texas Instruments

TB3R1DE4 by Texas Instruments

TB3R1DE4 by Texas Instruments is a CMOS Line Receiver with 16 terminals, operating at 3.3V. It offers differential output and Schmitt trigger input characteristics, ideal for industrial applications requiring fast response times. With a compact design of 9.9mm x 3.9mm x 1.75mm, it can handle up to 8A output current and operates in temperatures ranging from -40°C to 85°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,897 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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7,897

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-

-

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Digiode

USA . 4,314 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,314

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Euro-Tech

UK . 37 parts In-Stock

1+ parts

-

100+ parts

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37

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,562 parts In-Stock

1+ parts

$11.530

100+ parts

$1,070.731

1k+ parts

$10.377

10k+ parts

-

1,562

$11.530

$1,070.731

$10.377

-

DigiPath Technology Company

USA . 250 parts In-Stock

1+ parts

$12.696

100+ parts

-

1k+ parts

-

10k+ parts

-

250

$12.696

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-

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ChromeModa Solutions

Germany . 5,937 parts In-Stock

1+ parts

$12.955

100+ parts

$10.623

1k+ parts

-

10k+ parts

-

5,937

$12.955

$10.623

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IDEA Electronic Components Group

UK . 1,660 parts In-Stock

1+ parts

$12.955

100+ parts

$12.307

1k+ parts

$11.660

10k+ parts

-

1,660

$12.955

$12.307

$11.660

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AZTECH Wire

Italy . 566 parts In-Stock

1+ parts

$15.312

100+ parts

-

1k+ parts

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10k+ parts

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566

$15.312

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One Stop Electronics

USA . 1,289 parts In-Stock

1+ parts

$42.500

100+ parts

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1k+ parts

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10k+ parts

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1,289

$42.500

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Corphita

USA . 2,313 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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2,313

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Overview

Elevate your electronic designs with the TB3R1DE4 by Texas Instruments. Manufactured with precision and expertise, this line receiver offers seamless integration and reliable performance in a compact package. Ideal for a wide range of applications, this product ensures high-quality signal transmission while maximizing efficiency. With its advanced technology and durable construction, the TB3R1DE4 delivers unmatched value and benefits to customers looking for superior components for their projects. Trust Texas Instruments for innovation that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the product, making it suitable for various environments.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this product can handle a wide range of input voltages, providing flexibility in different applications.

No. of Functions: 4

Having multiple functions in one device simplifies the circuit design and reduces the need for additional components, leading to a more compact and cost-effective solution.

Package Shape: RECTANGULAR

The rectangular shape allows for easy integration into standardized designs and layouts, enhancing compatibility with existing systems.

Power Supplies (V): 3.3

The 3.3V power supply ensures compatibility with commonly used voltage levels in electronic systems, making it easy to integrate this product into various applications.

No. of Terminals: 16

Having 16 terminals provides ample connectivity options for interfacing with other components or external devices, enhancing the versatility of this product.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the circuit board, allowing for denser designs and more efficient use of available PCB real estate.

Minimum Supply Voltage: 3 V

With a low minimum supply voltage, this product can operate efficiently even in situations where power sources may be limited or fluctuating.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range ensures reliable performance in harsh environmental conditions or high-temperature environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature range allows this product to function effectively in cold climates or refrigerated environments.

Terminal Finish: NICKEL PALLADIUM GOLD

This terminal finish provides corrosion resistance and ensures reliable electrical connections, improving the overall lifespan and performance of the product.

Terminal Position: DUAL

Having dual terminal positions allows for flexibility in installation and connection options, accommodating different PCB layouts and mounting configurations.

Maximum Seated Height: 1.75 mm

The low seated height profile reduces the overall footprint of the product on the circuit board, contributing to space-saving designs and compact system layouts.

Width: 3.9 mm

The narrow width dimension makes this product suitable for applications where space constraints are a consideration, allowing for more efficient use of available space on the PCB.

Maximum Output Low Current: 8 Amp

With a high maximum output current capability, this product can drive power-hungry components or loads without the need for additional amplification circuits, simplifying the design process.

Receiver No. of Bits: 4

Featuring a 4-bit receiver design, this product is well-suited for applications that require high-speed data transmission and reliable signal integrity over short distances.

Differential Output: YES

Differential outputs provide noise immunity and signal integrity benefits, making this product ideal for applications in noisy or high-interference environments.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature specification ensures proper soldering and reflow processes for reliable and robust connections during assembly.

Peak Reflow Temperature °C: 250

The high peak reflow temperature tolerance allows for lead-free soldering processes and compatibility with industry-standard reflow profiles, ensuring manufacturing consistency and reliability.

Length: 9.9 mm

The compact length dimension enables easy integration of this product into space-constrained designs, contributing to smaller form factors and streamlined system layouts.

Temperature Grade: INDUSTRIAL

The industrial temperature grade specification ensures reliable operation and performance in demanding industrial environments with wide temperature variations and harsh conditions.

Maximum Receive Delay: 4 ns

With a low maximum receive delay, this product can quickly process incoming signals and data, making it suitable for high-speed communication applications that require minimal latency.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this product energy-efficient and reliable in noisy electrical environments.

Terminal Form: GULL WING

The gull wing terminal form allows for easy surface mounting on PCBs, providing mechanical stability and robust anchoring for reliable electrical connections.

Maximum Supply Current: 34 mA

With a low maximum supply current requirement, this product consumes minimal power during operation, contributing to energy-efficient and sustainable system designs.

Input Characteristics: DIFFERENTIAL SCHMITT TRIGGER

The differential Schmitt trigger input characteristics provide noise immunity and signal conditioning capabilities, ensuring reliable and stable operation in noisy or high-interference environments.

Nominal Supply Voltage: 3.3 V

Having a 3.3V nominal supply voltage simplifies power management and compatibility with standard voltage levels, making this product easy to integrate into existing electronic systems.

Terminal Pitch: 1.27 mm

The 1.27mm terminal pitch allows for easy soldering and assembly on standard pitch PCBs, facilitating efficient manufacturing processes and reliable electrical connections.

Moisture Sensitivity Level (MSL): 2

The MSL 2 rating indicates moderate moisture sensitivity, ensuring proper handling and storage procedures to maintain the product's integrity and performance during assembly and operation.

Interface IC Type: LINE RECEIVER

Being specifically designed as a line receiver interface IC, this product offers optimized signal reception and data processing capabilities for efficient communication in various applications.

Technical Specifications

Line Drivers & Receivers TB3R1DE4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Low Current:

8 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

250

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Receive Delay:

4 ns

Receiver No. of Bits:

4

Maximum Seated Height:

1.75 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

34 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

TB3R1DE4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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