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TAS5634DDVR

Texas Instruments

TAS5634DDVR by Texas Instruments

TAS5634DDVR by Texas Instruments is a 300W audio amplifier IC with 4 channels. It operates b/w 0-70°C, suitable for commercial applications. The package is small outline, surface-mountable, with dual terminals and moisture sensitivity level of 3.

Median Price

$8.795

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 4,889 parts In-Stock

1+ parts

$8.795

100+ parts

$7.170

1k+ parts

$4.780

10k+ parts

-

4,889

$8.795

$7.170

$4.780

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,881 parts In-Stock

1+ parts

$8.355

100+ parts

-

1k+ parts

-

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-

3,881

$8.355

-

-

-

Vyrian

USA . 3,952 parts In-Stock

1+ parts

-

100+ parts

-

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-

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-

3,952

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-

-

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Chip Stock

USA . 3,860 parts In-Stock

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-

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3,860

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,160 parts In-Stock

1+ parts

$3.443

100+ parts

-

1k+ parts

$3.969

10k+ parts

-

2,160

$3.443

-

$3.969

-

ChromeModa Solutions

Germany . 1,389 parts In-Stock

1+ parts

$3.869

100+ parts

$3.173

1k+ parts

-

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-

1,389

$3.869

$3.173

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IDEA Electronic Components Group

UK . 1,196 parts In-Stock

1+ parts

$3.869

100+ parts

-

1k+ parts

$3.482

10k+ parts

-

1,196

$3.869

-

$3.482

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Corphita

USA . 453 parts In-Stock

1+ parts

$7.916

100+ parts

-

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453

$7.916

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AZTECH Wire

Italy . 1,081 parts In-Stock

1+ parts

$22.190

100+ parts

-

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1,081

$22.190

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A-Z Elektronik GmbH

Germany . 7,388 parts In-Stock

1+ parts

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7,388

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DigiPath Technology Company

USA . 1,783 parts In-Stock

1+ parts

-

100+ parts

$3.488

1k+ parts

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1,783

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$3.488

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Kepictronics

USA . 1,000 parts In-Stock

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1,000

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Overview

Experience unparalleled audio quality and performance with the TAS5634DDVR by Texas Instruments, a leading manufacturer in the industry. Ideal for a wide range of applications in audio and video amplification, this compact yet powerful device offers exceptional value and benefits to customers. With a maximum output power of 300W and advanced features like dual terminal position and nickel palladium gold finish, this audio amplifier ensures crystal-clear sound and reliable performance. Upgrade your audio system today with the TAS5634DDVR and enjoy a premium listening experience like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the amplifier lightweight and durable, making it easy to transport and resistant to wear and tear.

Surface Mount: YES

Being surface mountable, this amplifier can be easily integrated into various systems and circuits, saving space and simplifying installation.

General IC Type: AUDIO AMPLIFIER

Designed specifically for audio amplification, this amplifier ensures high-quality sound output with minimal distortion.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature allows the amplifier to function efficiently even in demanding environments without overheating.

Nominal Output Power: 300 W

With a high nominal output power of 300W, this amplifier can deliver loud and clear audio signals, making it suitable for various applications.

Temperature Grade: COMMERCIAL

The commercial temperature grade ensures that the amplifier operates reliably within standard temperature ranges, making it suitable for commercial use.

No. of Channels: 4

Featuring 4 channels, this amplifier allows for multi-channel audio output, making it versatile for different audio setups and configurations.

Technical Specifications

Audio & Video Amplifiers TAS5634DDVR attributes and parameters. Explore more Audio & Video Amplifiers devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G44

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

Nominal Noise Figure:

105 dB

No. of Channels:

4

No. of Functions:

1

No. of Terminals:

44

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Nominal Output Power:

300 W

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

13.2 V

Minimum Supply Voltage (Vsup):

10.8 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6.1 mm

Trade Compliance

TAS5634DDVR General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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