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TAS5611PHDR

Texas Instruments

TAS5611PHDR by Texas Instruments

TAS5611PHDR by Texas Instruments is a 130W audio amplifier IC with 2 channels. It operates b/w 0-70°C, suitable for commercial applications. The package is a square flatpack with heat sink, measuring 14x14mm and has a terminal pitch of 0.8mm.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,380 parts In-Stock

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4,380

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Digiode

USA . 512 parts In-Stock

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512

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Chip Stock

USA . 225 parts In-Stock

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225

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,370 parts In-Stock

1+ parts

$1.769

100+ parts

-

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$2.337

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1,370

$1.769

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$2.337

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DigiPath Technology Company

USA . 2,086 parts In-Stock

1+ parts

$1.948

100+ parts

$1.792

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2,086

$1.948

$1.792

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ChromeModa Solutions

Germany . 864 parts In-Stock

1+ parts

$1.988

100+ parts

$1.630

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864

$1.988

$1.630

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IDEA Electronic Components Group

UK . 399 parts In-Stock

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$1.988

100+ parts

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$1.789

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399

$1.988

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$1.789

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Advanced Electronics

New Zealand . 64 parts In-Stock

1+ parts

$4.681

100+ parts

$4.260

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$3.838

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64

$4.681

$4.260

$3.838

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One Stop Electronics

USA . 568 parts In-Stock

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$4.800

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568

$4.800

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AZTECH Wire

Italy . 856 parts In-Stock

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$5.778

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856

$5.778

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Microchip USA

USA . 484 parts In-Stock

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$25.880

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$25.690

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$25.690

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$25.510

484

$25.880

$25.690

$25.690

$25.510

Component Stockers USA

USA . 455 parts In-Stock

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$99.990

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455

$99.990

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Lixinc

USA . 7,909 parts In-Stock

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7,909

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Corphita

USA . 1,287 parts In-Stock

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Kepictronics

USA . 75 parts In-Stock

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75

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Overview

Experience unparalleled audio quality with the TAS5611PHDR by Texas Instruments, a leading manufacturer in the industry. This audio amplifier is perfect for a wide range of applications in the audio and video realm, offering a powerful output of 130W while maintaining a sleek and compact design. With a temperature range from 0 to 70°C, this amplifier ensures reliable performance in any environment. Upgrade your audio experience today with the TAS5611PHDR and enjoy top-notch sound quality like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is commonly used in electronic components due to its lightweight and durable properties, making this amplifier sturdy and suitable for long-term use.

No. of Terminals: 64

Having 64 terminals allows for more connections and versatility in setting up the amplifier for various audio configurations.

Nominal Output Power: 130 W

With a high output power of 130W, this amplifier can deliver strong, clear audio signals, suitable for high-quality sound systems.

Minimum Supply Voltage (Vsup): 10.8 V

The low minimum supply voltage requirement of 10.8V ensures compatibility with a wide range of power sources, making it convenient for different applications.

Temperature Grade: COMMERCIAL

Being designated as commercial grade ensures that this amplifier is tested and proven to perform reliably in typical operating conditions, providing peace of mind for users.

No. of Channels: 2

Having 2 channels allows for stereo sound output, providing a more immersive audio experience for listeners.

Maximum Supply Voltage (Vsup): 13.2 V

With a maximum supply voltage of 13.2V, this amplifier can handle higher power inputs, giving room for increased performance headroom.

Technical Specifications

Audio & Video Amplifiers TAS5611PHDR attributes and parameters. Explore more Audio & Video Amplifiers devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Nominal Output Power:

130 W

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

13.2 V

Minimum Supply Voltage (Vsup):

10.8 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Trade Compliance

TAS5611PHDR General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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