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SNJ55113FK

Texas Instruments

SNJ55113FK by Texas Instruments

SNJ55113FK by Texas Instruments is a Line Driver with 2 functions, operating at 5V. It features a max transmit delay of 20ns and operates in temperatures ranging from -55 to 125°C. Ideal for military applications requiring high-speed signal transmission in compact spaces.

Median Price

$52.864

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 50 parts In-Stock

1+ parts

-

100+ parts

$46.990

1k+ parts

$42.040

10k+ parts

$39.570

50

-

$46.990

$42.040

$39.570

DigiKey

USA . 50 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

50

-

-

-

-

Verical

USA . 26 parts In-Stock

1+ parts

-

100+ parts

$58.737

1k+ parts

$52.550

10k+ parts

$49.462

26

-

$58.737

$52.550

$49.462

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey Marketplace

USA . 60 parts In-Stock

1+ parts

$41.060

100+ parts

-

1k+ parts

-

10k+ parts

-

60

$41.060

-

-

-

Digiode

USA . 3,446 parts In-Stock

1+ parts

$43.130

100+ parts

-

1k+ parts

-

10k+ parts

-

3,446

$43.130

-

-

-

Vyrian

USA . 4,577 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,577

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,504 parts In-Stock

1+ parts

$5.533

100+ parts

-

1k+ parts

$6.294

10k+ parts

-

1,504

$5.533

-

$6.294

-

DigiPath Technology Company

USA . 269 parts In-Stock

1+ parts

$6.093

100+ parts

$5.605

1k+ parts

-

10k+ parts

-

269

$6.093

$5.605

-

-

ChromeModa Solutions

Germany . 1,236 parts In-Stock

1+ parts

$6.217

100+ parts

$5.098

1k+ parts

-

10k+ parts

-

1,236

$6.217

$5.098

-

-

IDEA Electronic Components Group

UK . 367 parts In-Stock

1+ parts

$6.217

100+ parts

-

1k+ parts

$5.595

10k+ parts

-

367

$6.217

-

$5.595

-

Corphita

USA . 4,369 parts In-Stock

1+ parts

$40.860

100+ parts

-

1k+ parts

-

10k+ parts

-

4,369

$40.860

-

-

-

Microchip USA

USA . 2,028 parts In-Stock

1+ parts

$94.900

100+ parts

$93.250

1k+ parts

$92.420

10k+ parts

$91.600

2,028

$94.900

$93.250

$92.420

$91.600

Overview

Upgrade your communication systems with the Texas Instruments SNJ55113FK Line Driver & Receiver. Crafted from top-quality ceramic and metal-sealed cofired materials, this versatile chip carrier offers military-grade reliability with a wide operating temperature range. With its fast transmit delay of 20 ns and complementary output polarity, the SNJ55113FK ensures seamless data transmission in demanding environments. Trust Texas Instruments to deliver superior performance and durability for all your application needs.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material ensures durability and reliability, making the product suitable for rugged environments.

Surface Mount: YES

Easy installation and space-saving design for modern PCB layouts.

Maximum Supply Voltage: 5.5 V

Can handle higher voltage inputs without the risk of damage, providing a wide operating range.

No. of Functions: 2

Dual functionality allows for versatile applications in a single package.

Screening Level: MIL-PRF-38535

Meets military standards for performance and reliability in demanding environments.

Maximum Transmit Delay: 20 ns

Fast signal transmission for real-time applications.

Power Supplies (V): 5

Operates efficiently with a common available power supply voltage.

Maximum Output Low Current: 40000 Amp

Capable of driving heavy loads with ease.

Temperature Grade: MILITARY

Designed to withstand extreme temperature variations and harsh conditions.

Technology: BIPOLAR

Reliable bipolar technology ensures stable and accurate signal transmission.

Technical Specifications

Line Drivers & Receivers SNJ55113FK attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Additional Features:

1 SINGLE INPUT DRIVER

Differential Output:

YES

Driver No. of Bits:

2

Maximum High Level Input Current:

.00004 Amp

Input Characteristics:

GATED

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

S-CQCC-N20

JESD-609 Code:

e0

Length:

8.89 mm

No. of Functions:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Minimum Out Swing:

1.6 V

Maximum Output Low Current:

40000 Amp

Output Polarity:

COMPLEMENTARY

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

LCC20,.35SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Screening Level:

MIL-PRF-38535

Maximum Seated Height:

2.03 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

65 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Maximum Supply Voltage-1:

5.5 V

Minimum Supply Voltage-1:

4.5 V

Nominal Supply Voltage-1:

5 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Maximum Transmit Delay:

20 ns

Width:

8.89 mm

Trade Compliance

SNJ55113FK Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-594-6652, 5962015946652

NIIN

015946652

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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