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SNJ54LS279AW

Texas Instruments

SNJ54LS279AW by Texas Instruments

SNJ54LS279AW by Texas Instruments is a TTL technology latch with 2 bits, 4 functions, and a propagation delay of 22 ns. It operates at a supply voltage of 5V and has a max operating temperature of 125°C. Ideal for military applications requiring low-level trigger type latches in ceramic packages.

Median Price

$12.361

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Freelance Electronics

USA . 7 parts In-Stock

1+ parts

$12.361

100+ parts

$12.979

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$12.238

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7

$12.361

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$12.238

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Vyrian

USA . 6,918 parts In-Stock

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Digiode

USA . 3,501 parts In-Stock

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3,501

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Resion

USA . 6 parts In-Stock

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6

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Distributors (Availability)

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AZTECH Wire

Italy . 527 parts In-Stock

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$7.256

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527

$7.256

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Parana Technologies

USA . 589 parts In-Stock

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$8.572

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$9.233

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589

$8.572

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DigiPath Technology Company

USA . 42 parts In-Stock

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$9.439

100+ parts

$8.684

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42

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$8.684

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ChromeModa Solutions

Germany . 466 parts In-Stock

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$9.632

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$7.898

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466

$9.632

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IDEA Electronic Components Group

UK . 253 parts In-Stock

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$9.632

100+ parts

$9.150

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$8.669

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253

$9.632

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$8.669

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Advanced Electronics

New Zealand . 71 parts In-Stock

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$10.725

100+ parts

$9.760

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$8.794

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One Stop Electronics

USA . 327 parts In-Stock

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$53.000

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Corphita

USA . 2,386 parts In-Stock

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Microchip USA

USA . 2,207 parts In-Stock

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Overview

Unlock the power of efficient data storage and retrieval with the SNJ54LS279AW by Texas Instruments. Crafted with precision using high-quality materials, this latches & flip-flops device offers fast propagation delays, low power consumption, and exceptional performance in a variety of military-grade applications. With its reliable design and advanced technology, customers can trust in the value and benefits that this product brings to their projects, making it a top choice for those seeking superior functionality and durability.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

This material provides durability and protection, making the product reliable in harsh environments.

Propagation Delay At Nominal Supply: 22 ns

Low propagation delay ensures quick response time, making this product suitable for high-speed applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on PCBs, saving space and reducing assembly time.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard voltage of 5V ensures compatibility with common electronic systems.

No. of Functions: 4

Having multiple functions in one device saves space and simplifies circuit design.

Technology: TTL

TTL technology offers reliable digital signal processing, making this product suitable for various applications.

Temperature Grade: MILITARY

Designed to operate in military-grade temperature ranges, ensuring reliability in extreme conditions.

Technical Specifications

Latches & Flip-Flops SNJ54LS279AW attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Additional Features:

WITH DUAL S INPUT FOR TWO FUNCTIONS

Family:

LS

JESD-30 Code:

R-GDFP-F16

JESD-609 Code:

e0

Length:

10.16 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

Maximum I (ol):

4 Amp

No. of Bits:

2

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DFP

Package Equivalence Code:

FL16,.3

Package Shape:

Package Style (Meter):

FLATPACK

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

7 mA

Propagation Delay At Nominal Supply:

22 ns

Propagation Delay (tpd):

27 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Screening Level:

MIL-PRF-38535

Maximum Seated Height:

2.03 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

LOW LEVEL

Width:

6.73 mm

Trade Compliance

SNJ54LS279AW Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-271-8228, 5962012718228

NIIN

012718228

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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