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SNJ54LS153J

Texas Instruments

SNJ54LS153J by Texas Instruments

SNJ54LS153J by Texas Instruments is a 4-bit TTL multiplexer with 2 functions, 4 inputs, and a propagation delay of 23 ns at 5V. It operates in military-grade temperatures (-55 to 125°C) and has a max power supply current of 10mA. Ideal for applications requiring high-speed data switching in harsh environments.

Median Price

$9.550

Lifecycle Status

Suppliers In-Stock

29

In-Stock Inventory

1k+

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Rochester

USA . 10 parts In-Stock

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$9.550

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$9.360

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$9.170

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Freelance Electronics

USA . 903 parts In-Stock

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TEDSS.com

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Digiode

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Vyrian

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ECAB

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LWI Electronics Inc

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MISTER SPROCKETS

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Atlantic Semiconductor

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Sinequanon

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Sogenti Electronics

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Mil-Aero Solutions, Inc.

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

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PC Components Company LLC

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Sunrise Surplus Inc.

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Manoshevitz Elec. Sales

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Beltway Electronics Company

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Semi Source

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Digital Electronic Gebert Verwaltungs UG

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Odi Ramu Company

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Odintec Ltd.

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Parana Technologies

USA . 1,255 parts In-Stock

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DigiPath Technology Company

USA . 16 parts In-Stock

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ChromeModa Solutions

Germany . 4,651 parts In-Stock

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IDEA Electronic Components Group

UK . 1,304 parts In-Stock

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Corphita

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AZTECH Wire

Italy . 1,116 parts In-Stock

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Overview

Enhance your electronic projects with the high-quality SNJ54LS153J multiplexer/demultiplexer from Texas Instruments. Known for their reliable and durable components, Texas Instruments delivers top-notch performance in a variety of applications. With its versatile functionality and precise design, this component offers exceptional value by streamlining circuitry and enhancing efficiency. Elevate your projects with the superior quality and innovation that Texas Instruments brings to the table.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides excellent durability and protection for the internal components, ensuring a long lifespan for the product.

Propagation Delay At Nominal Supply: 23 ns

Fast propagation delay ensures quick response times and efficient signal processing.

No. of Functions: 2

Allows for versatile functionality, enabling the product to perform multiple tasks efficiently.

No. of Inputs: 4

Offers a good number of inputs for flexibility in connecting multiple sources to the device.

Nominal Supply Voltage / Vsup (V): 5

Common voltage supply ensures compatibility with standard power sources.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, making it suitable for a wide range of operating environments.

Technology: TTL

Utilizes TTL technology known for its reliability and compatibility with various systems.

Technical Specifications

Multiplexer & Demultiplexer SNJ54LS153J attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

LS

JESD-30 Code:

R-GDIP-T16

JESD-609 Code:

e0

Length:

19.56 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

Maximum I (ol):

8 Amp

No. of Bits:

4

No. of Functions:

2

No. of Inputs:

4

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

10 mA

Propagation Delay At Nominal Supply:

23 ns

Propagation Delay (tpd):

26 ns

Qualification:

Not Qualified

Screening Level:

MIL-PRF-38535

Maximum Seated Height:

5.08 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

SNJ54LS153J Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-050-0919, 5962010500919, 5962-01-263-0976, 5962012630976, 5962-01-496-5435, 5962014965435

NIIN

010500919, 012630976, 014965435

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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