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SNJ54HCT238J

Texas Instruments

SNJ54HCT238J by Texas Instruments

SNJ54HCT238J by Texas Instruments is a CMOS decoder with 16 terminals, operating b/w -55°C to 125°C. It has a nominal voltage of 5V and comes in a ceramic, glass-sealed package. Ideal for military applications requiring high-temperature resistance and reliable performance.

Median Price

$14.930

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 24 parts In-Stock

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$11.700

100+ parts

$11.470

1k+ parts

$11.230

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24

$11.700

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$11.230

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DigiKey

USA . 24 parts In-Stock

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-

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$14.930

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Verical

USA . 24 parts In-Stock

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$19.413

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$17.550

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24

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$19.413

$17.550

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Distributors (In-Stock)

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Freelance Electronics

USA . 41 parts In-Stock

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$9.342

100+ parts

$9.809

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$9.248

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41

$9.342

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$9.248

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Digiode

USA . 4,568 parts In-Stock

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$15.694

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Vyrian

USA . 4,447 parts In-Stock

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Bristol Electronics

USA . 75 parts In-Stock

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Atlantic Semiconductor

USA . 75 parts In-Stock

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DigiKey Marketplace

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PC Components Company LLC

USA . 23 parts In-Stock

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Mil-Aero Solutions, Inc.

USA . 11 parts In-Stock

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Manoshevitz Elec. Sales

Israel . 8 parts In-Stock

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Electronic Expediters

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GSS - Global Semi Support

USA . 1 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 3,787 parts In-Stock

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$14.868

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$14.868

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Parana Technologies

USA . 2,144 parts In-Stock

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$29.428

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$59.235

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$29.428

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$59.235

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ChromeModa Solutions

Germany . 4,117 parts In-Stock

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$33.065

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$27.113

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4,117

$33.065

$27.113

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IDEA Electronic Components Group

UK . 2,076 parts In-Stock

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$33.065

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$31.412

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$29.758

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2,076

$33.065

$31.412

$29.758

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Microchip USA

USA . 2,774 parts In-Stock

1+ parts

$41.610

100+ parts

$41.010

1k+ parts

$40.720

10k+ parts

$40.420

2,774

$41.610

$41.010

$40.720

$40.420

DigiPath Technology Company

USA . 278 parts In-Stock

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$29.811

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$29.811

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Overview

Unlock the power of precision with the SNJ54HCT238J by Texas Instruments. Crafted with top-quality ceramic and glass-sealed materials, this decoder & driver offers unparalleled reliability in demanding applications. Whether you're in aerospace, defense, or industrial sectors, this military-grade technology ensures optimal performance in extreme temperatures. Experience seamless operation and peace of mind with Texas Instruments' renowned expertise in semiconductor manufacturing. Elevate your projects with the SNJ54HCT238J - where quality meets innovation.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Ceramic and glass-sealed package body materials provide durability and protection for the decoder & driver, ensuring reliable operation even in harsh environments.

Screening Level: 38535Q/M;38534H;883B

High screening levels ensure quality and reliability of the product, making it suitable for critical applications where performance is essential.

Nominal Supply Voltage / Vsup (V): 5

5V supply voltage allows for compatibility with various systems and power sources, making the decoder & driver versatile and widely applicable.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, this decoder & driver can function effectively even in high-temperature environments without overheating.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, improving the efficiency and performance of the decoder & driver.

Technical Specifications

Decoder & Drivers SNJ54HCT238J attributes and parameters. Explore more Decoder & Drivers devices from Texas Instruments

Specs

JESD-30 Code:

R-GDIP-T16

JESD-609 Code:

e0

Logic IC Type:

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Power Supplies (V):

5

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Sub-Category:

Decoder/Drivers

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SNJ54HCT238J Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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