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SNJ54HC175J

Texas Instruments

SNJ54HC175J by Texas Instruments

SNJ54HC175J by Texas Instruments is a 4-bit latch with a propagation delay of 45 ns, suitable for military applications. It operates at a supply voltage range of 2-6V and has a max frequency of 21 MHz. With MIL-PRF-38535 screening level, it offers high reliability in harsh environments.

Median Price

$6.874

Lifecycle Status

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AZTECH Wire

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IDEA Electronic Components Group

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Microchip USA

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DigiPath Technology Company

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Overview

Enhance your electronic projects with the SNJ54HC175J by Texas Instruments, a top-quality latches & flip-flops component designed to meet MIL-PRF-38535 standards. This ceramic, glass-sealed package boasts a 45 ns propagation delay and a wide operating temperature range, making it ideal for demanding military applications. With a maximum frequency of 21 MHz and a low power supply current, this versatile product delivers high performance and reliability. Trust Texas Instruments for cutting-edge technology that exceeds expectations. Elevate your designs with the SNJ54HC175J today!

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

This package body material ensures durability and reliability of the latch or flip-flop, making it suitable for industrial and military applications.

Propagation Delay At Nominal Supply: 45 ns

The low propagation delay ensures fast response times, making this latch or flip-flop ideal for high-speed applications where timing is critical.

No. of Bits: 4

With 4 bits, this latch or flip-flop can store a moderate amount of data, suitable for various digital circuits and systems.

Nominal Supply Voltage: 5V

The 5V supply voltage is commonly used in many electronic systems, ensuring compatibility and easy integration of this latch or flip-flop.

Temperature Grade: MILITARY

Designed to operate in harsh environments, this latch or flip-flop is built to meet military standards for reliability and performance under extreme conditions.

Maximum Frequency At Nominal Supply: 21,000,000 Hz

The high maximum frequency capability of this latch or flip-flop allows it to be used in high-speed digital systems and communication applications.

Technology: CMOS

Using CMOS technology provides low power consumption and high noise immunity, making this latch or flip-flop energy efficient and reliable.

Technical Specifications

Latches & Flip-Flops SNJ54HC175J attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

HC

JESD-30 Code:

R-GDIP-T16

JESD-609 Code:

e0

Length:

19.56 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

21000000 Hz

Maximum I (ol):

5.2 Amp

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Power Supplies (V):

2/6

Maximum Power Supply Current (ICC):

.08 mA

Propagation Delay At Nominal Supply:

45 ns

Propagation Delay (tpd):

255 ns

Qualification:

Not Qualified

Screening Level:

MIL-PRF-38535

Maximum Seated Height:

5.08 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

6.92 mm

Minimum fmax:

25 MHz

Trade Compliance

SNJ54HC175J Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-240-2031, 5962012402031, 5962-01-276-8331, 5962012768331

NIIN

012402031, 012768331

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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