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SNJ54HC174FK

Texas Instruments

SNJ54HC174FK by Texas Instruments

SNJ54HC174FK by Texas Instruments is a 6-bit latches & flip-flops chip with a propagation delay of 48ns. It operates at a supply voltage range of 2-6V, has a max frequency of 21MHz, and is MILITARY grade. Ideal for applications requiring positive edge triggering in harsh environments.

Median Price

$24.000

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 7 parts In-Stock

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$24.000

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Vyrian

USA . 3,739 parts In-Stock

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Digiode

USA . 1,847 parts In-Stock

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Electronic Expediters

USA . 45 parts In-Stock

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Resion

USA . 25 parts In-Stock

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25

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Mil-Aero Solutions, Inc.

USA . 11 parts In-Stock

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One Stop Electronics

USA . 1,224 parts In-Stock

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$11.000

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AZTECH Wire

Italy . 884 parts In-Stock

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$19.292

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$19.292

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Parana Technologies

USA . 1,774 parts In-Stock

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$24.876

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$25.565

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$24.876

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DigiPath Technology Company

USA . 668 parts In-Stock

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$27.391

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$25.200

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ChromeModa Solutions

Germany . 3,101 parts In-Stock

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$27.950

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$22.919

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IDEA Electronic Components Group

UK . 2,337 parts In-Stock

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$27.950

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$26.552

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$25.155

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Corphita

USA . 3,819 parts In-Stock

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Microchip USA

USA . 2,369 parts In-Stock

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Overview

Discover the unparalleled quality and reliability of the SNJ54HC174FK by Texas Instruments, a leading manufacturer in the industry. This latches & flip-flops category product offers seamless functionality with a fast propagation delay and high performance. Ideal for military applications, this chip carrier style component provides true output polarity and positive edge triggering. Trust Texas Instruments to deliver cutting-edge technology that exceeds expectations and ensures top-notch results for your projects. Unlock the potential of your designs with the SNJ54HC174FK today.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material provides durability and reliability, ensuring long-term functionality.

Propagation Delay At Nominal Supply: 48 ns

Low propagation delay enables fast operation and timely signal processing.

Surface Mount: YES

Ease of installation and space-saving design make it suitable for compact electronic devices.

No. of Bits: 6

Ideal for applications requiring processing of up to 6 bits of information.

Nominal Supply Voltage / Vsup (V): 5

Compatible with common 5V power supplies, making it easy to integrate into existing systems.

Trigger Type: POSITIVE EDGE

Positive edge triggering allows for precise synchronization and control of signal transitions.

Maximum Operating Temperature: 125 °C

Suitable for use in a wide range of operating environments without compromising performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing overall efficiency.

Technical Specifications

Latches & Flip-Flops SNJ54HC174FK attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

HC

JESD-30 Code:

S-CQCC-N20

JESD-609 Code:

e0

Length:

8.89 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

21000000 Hz

Maximum I (ol):

5.2 Amp

No. of Bits:

6

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

LCC20,.35SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Packing Method:

TUBE

Power Supplies (V):

2/6

Maximum Power Supply Current (ICC):

.08 mA

Propagation Delay At Nominal Supply:

48 ns

Propagation Delay (tpd):

240 ns

Qualification:

Not Qualified

Screening Level:

MIL-PRF-38535

Maximum Seated Height:

2.03 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Trigger Type:

POSITIVE EDGE

Width:

8.89 mm

Minimum fmax:

25 MHz

Trade Compliance

SNJ54HC174FK Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-264-9061, 5962012649061, 5962-01-647-7359, 5962016477359

NIIN

012649061, 016477359

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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