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SNJ54HC112J

Texas Instruments

SNJ54HC112J by Texas Instruments

SNJ54HC112J by Texas Instruments is a dual-function latches & flip-flops IC with 41ns propagation delay, suitable for military applications. It operates at a supply voltage range of 2-6V, has a max frequency of 17MHz, and features complementary output polarity. This CMOS technology device comes in a ceramic package with through-hole terminals.

Median Price

$15.912

Lifecycle Status

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Rochester

USA . 69 parts In-Stock

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$12.730

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$11.390

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$10.720

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$10.720

DigiKey

USA . 69 parts In-Stock

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$16.750

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Verical

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$15.912

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$14.238

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$13.400

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$13.400

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Freelance Electronics

USA . 312 parts In-Stock

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$5.664

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$5.947

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$5.607

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American Microsemiconductor Inc.

USA . 70 parts In-Stock

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$6.230

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Bristol Electronics

USA . 155 parts In-Stock

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$6.720

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$2.912

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Digiode

USA . 3,824 parts In-Stock

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$11.676

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Vyrian

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Microfarads

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ComSIT Distribution GmbH

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PC Components Company LLC

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Electronic Expediters

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LWI Electronics Inc

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Odintec Ltd.

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Beltway Electronics Company

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Extreme Components

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Manoshevitz Elec. Sales

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NAC Semi

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Mil-Aero Solutions, Inc.

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Elcom Components

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Parana Technologies

USA . 1,839 parts In-Stock

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$9.054

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$9.715

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DigiPath Technology Company

USA . 646 parts In-Stock

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$9.970

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$9.172

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ChromeModa Solutions

Germany . 3,968 parts In-Stock

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$8.342

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IDEA Electronic Components Group

UK . 1,826 parts In-Stock

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$9.664

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$9.156

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Corphita

USA . 3,267 parts In-Stock

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Microchip USA

USA . 2,696 parts In-Stock

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$30.830

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$30.610

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Assy Fe

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Kepictronics

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Overview

Unlock the power of Texas Instruments with the SNJ54HC112J latches and flip-flops. With a MILITARY-grade screening level and CERAMIC, GLASS-SEALED package body material, this product offers unmatched quality and reliability. Ideal for applications requiring fast propagation delay and low power consumption, the SNJ54HC112J is the perfect choice for military and aerospace industries. Experience the value and benefits of Texas Instruments with this high-performance component.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

This material ensures durability and protection for the components inside, making the product suitable for rugged environments.

Propagation Delay At Nominal Supply: 41 ns

Fast propagation delay allows for quick response times, making this product efficient for time-sensitive applications.

No. of Functions: 2

Multiple functions in a single package provide versatility and convenience in circuit design.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard voltage level, making it compatible with a wide range of systems.

Temperature Grade: MILITARY

Suitable for use in harsh environmental conditions, meeting stringent military standards.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency and reliability of the product.

Technical Specifications

Latches & Flip-Flops SNJ54HC112J attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

HC

JESD-30 Code:

R-GDIP-T16

JESD-609 Code:

e0

Length:

19.56 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

17000000 Hz

Maximum I (ol):

-4 Amp

No. of Bits:

2

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Power Supplies (V):

2/6

Maximum Power Supply Current (ICC):

.08 mA

Propagation Delay At Nominal Supply:

41 ns

Propagation Delay (tpd):

185 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Screening Level:

MIL-PRF-38535

Maximum Seated Height:

5.08 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trigger Type:

NEGATIVE EDGE

Width:

6.92 mm

Minimum fmax:

20 MHz

Trade Compliance

SNJ54HC112J Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-321-0158, 5962013210158

NIIN

013210158

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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