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SNJ54AHC74J

Texas Instruments

SNJ54AHC74J by Texas Instruments

SNJ54AHC74J by Texas Instruments is a CMOS latches & flip-flops IC with 2 functions, 10.5 ns propagation delay, and 3.3V nominal voltage. It is MILITARY grade with positive edge trigger type, suitable for applications requiring high-speed data transfer in harsh environments. The package style is IN-LINE, with through-hole terminal form and max frequency of 75 MHz at nominal supply.

Median Price

$10.206

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 67 parts In-Stock

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-

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$10.206

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Bristol Electronics

USA . 6 parts In-Stock

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$8.960

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$8.960

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Digiode

USA . 3,968 parts In-Stock

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Vyrian

USA . 3,452 parts In-Stock

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Microfarads

USA . 6 parts In-Stock

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Cyclops Electronics Ltd

UK . 4 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 112 parts In-Stock

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$8.450

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112

$8.450

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Parana Technologies

USA . 441 parts In-Stock

1+ parts

$30.044

100+ parts

$2,790.016

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$27.039

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441

$30.044

$2,790.016

$27.039

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DigiPath Technology Company

USA . 2,360 parts In-Stock

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$33.082

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$33.082

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ChromeModa Solutions

Germany . 3,114 parts In-Stock

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$33.757

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$27.681

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3,114

$33.757

$27.681

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IDEA Electronic Components Group

UK . 739 parts In-Stock

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$33.757

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$32.069

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$30.381

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739

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Lixinc

USA . 14,858 parts In-Stock

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Microchip USA

USA . 1,713 parts In-Stock

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Corphita

USA . 1,256 parts In-Stock

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Overview

Experience unparalleled quality and reliability with the Texas Instruments SNJ54AHC74J Latches & Flip-Flops. Designed with precision and excellence in mind, this product is ideal for a wide range of applications. Whether you're looking for high-performance solutions or unmatched durability, this device has got you covered. Trust Texas Instruments to deliver superior products that exceed expectations. Upgrade your projects with the SNJ54AHC74J and unlock endless possibilities today.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

This material provides excellent protection for the internal components, ensuring durability and reliability in various operating conditions.

Propagation Delay At Nominal Supply: 10.5 ns

Low propagation delay allows for fast switching between functions, improving overall performance.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a standard supply voltage, making it compatible with a wide range of systems.

Maximum Operating Temperature: 125 °C

Capable of functioning in high-temperature environments, increasing versatility and applicability.

Maximum Frequency At Nominal Supply: 75000000 Hz

High-frequency capability enables rapid data processing and signal handling, ideal for time-sensitive applications.

Technical Specifications

Latches & Flip-Flops SNJ54AHC74J attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

AHC/VHC/H/U/V

JESD-30 Code:

R-GDIP-T14

JESD-609 Code:

e0

Length:

19.56 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

75000000 Hz

Maximum I (ol):

8 Amp

No. of Bits:

1

No. of Functions:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2/5.5

Maximum Power Supply Current (ICC):

.02 mA

Propagation Delay At Nominal Supply:

10.5 ns

Propagation Delay (tpd):

17.5 ns

Qualification:

Not Qualified

Screening Level:

MIL-PRF-38535

Maximum Seated Height:

5.08 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

POSITIVE EDGE

Width:

7.62 mm

Minimum fmax:

110 MHz

Trade Compliance

SNJ54AHC74J Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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