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SNJ54AC32J

Texas Instruments

SNJ54AC32J by Texas Instruments

SNJ54AC32J by Texas Instruments is a CMOS logic gate with 4 functions, 2 inputs, and 12ns propagation delay at 3.3V supply. It operates in military-grade temperatures from -55 to 125°C, suitable for applications requiring high reliability and performance in harsh environments. With a max power supply current of 0.04mA and MIL-PRF-38535 screening level, it is ideal for defense and aerospace industries.

Median Price

$10.034

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 42 parts In-Stock

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$8.418

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$8.418

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Rochester

USA . 4 parts In-Stock

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-

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$11.650

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$10.420

10k+ parts

$9.810

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$11.650

$10.420

$9.810

DigiKey

USA . 4 parts In-Stock

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Digiode

USA . 1,761 parts In-Stock

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$10.697

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Vyrian

USA . 5,150 parts In-Stock

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Odi Ramu Company

Canada . 69 parts In-Stock

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QIE Inc.

USA . 24 parts In-Stock

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ComSIT Distribution GmbH

Germany . 4 parts In-Stock

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Resion

USA . 1 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 285 parts In-Stock

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$9.200

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$9.200

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Component Stockers USA

USA . 88 parts In-Stock

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$10.100

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Corphita

USA . 2,380 parts In-Stock

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$10.134

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Parana Technologies

USA . 964 parts In-Stock

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$20.158

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$20.102

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964

$20.158

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DigiPath Technology Company

USA . 366 parts In-Stock

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$22.196

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$20.420

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$22.196

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IDEA Electronic Components Group

UK . 2,247 parts In-Stock

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$22.649

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$21.517

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$20.384

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2,247

$22.649

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$20.384

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ChromeModa Solutions

Germany . 2,148 parts In-Stock

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$22.649

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$18.572

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Microchip USA

USA . 1,797 parts In-Stock

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$28.640

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$28.230

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$28.030

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$27.830

1,797

$28.640

$28.230

$28.030

$27.830

Perfect Parts

USA . 96 parts In-Stock

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Overview

Discover the cutting-edge SNJ54AC32J logic gate from Texas Instruments, a trusted manufacturer known for top-quality components. Perfect for military-grade applications, this versatile device offers fast propagation delay and low power consumption. With 4 functions in one package, it maximizes efficiency while reducing space requirements. Upgrade your projects with the reliable performance and advanced technology of the SNJ54AC32J for seamless integration and superior results.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides durability and protection to the internal components of the logic gates, ensuring reliable performance and longevity.

Propagation Delay At Nominal Supply: 12 ns

Fast propagation delay allows for quick processing of input signals, making this product suitable for applications requiring high-speed operations.

No. of Functions: 4

Having multiple functions in a single component can help reduce the number of devices needed in a circuit, simplifying the design and potentially saving space.

Nominal Supply Voltage / Vsup (V): 3.3

Works well with common supply voltages, making integration into existing systems seamless.

Temperature Grade: MILITARY

Designed to meet military specifications, indicating robustness and reliability in challenging environmental conditions.

Technical Specifications

Logic Gates SNJ54AC32J attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

AC

JESD-30 Code:

R-GDIP-T14

JESD-609 Code:

e0

Length:

19.56 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3/5

Maximum Power Supply Current (ICC):

.04 mA

Propagation Delay At Nominal Supply:

12 ns

Propagation Delay (tpd):

12 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Screening Level:

MIL-PRF-38535

Maximum Seated Height:

5.08 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Trade Compliance

SNJ54AC32J Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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