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SNC54LS325J

Texas Instruments

SNC54LS325J by Texas Instruments

SNC54LS325J by Texas Instruments is a TTL technology oscillator with 16 terminals and 5V supply voltage. It operates b/w -55°C to 125°C, suitable for MIL-STD-883 Class B applications. Packaged in ceramic, it features through-hole mounting for robust performance.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,390 parts In-Stock

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Digiode

USA . 2,366 parts In-Stock

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Parana Technologies

USA . 1,198 parts In-Stock

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$2.070

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$2.591

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$2.070

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$2.591

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DigiPath Technology Company

USA . 1,454 parts In-Stock

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$2.279

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$2.097

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ChromeModa Solutions

Germany . 1,124 parts In-Stock

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$2.326

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$1.907

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$2.326

$1.907

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IDEA Electronic Components Group

UK . 628 parts In-Stock

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$2.326

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$2.093

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628

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One Stop Electronics

USA . 497 parts In-Stock

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$4.010

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Ampacity Inc.

Singapore . 333 parts In-Stock

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$4.010

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Semicontronic

India . 614 parts In-Stock

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$5.010

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$4.885

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$4.860

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AZTECH Wire

Italy . 632 parts In-Stock

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$15.745

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Corphita

USA . 4,921 parts In-Stock

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Corohmni

South Africa . 431 parts In-Stock

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Overview

Discover the power of the SNC54LS325J by Texas Instruments, a top-quality Other Function Oscillator designed to meet your needs. With its MIL-STD-883 Class B screening level and reliable TTL technology, this product offers unparalleled performance and durability. Whether you're in need of precise timing or signal generation, this oscillator is perfect for a wide range of applications. Trust in Texas Instruments to deliver exceptional value and benefits with every product, giving you the advantage you need to succeed.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic packages offer excellent thermal properties, providing good heat dissipation and reliability for the oscillator.

Screening Level: MIL-STD-883 Class B (Modified)

Compliance with MIL-STD-883 Class B ensures that the oscillator meets high-quality standards and reliability requirements for military and aerospace applications.

Technology: TTL

TTL technology offers high-speed operation and low power consumption, making it suitable for applications where speed and efficiency are critical.

Nominal Supply Voltage: 5 V

Operating at a standard 5V voltage simplifies the power supply requirements and makes integration into existing systems straightforward.

No. of Terminals: 16

Having 16 terminals allows for versatile connectivity options and compatibility with different circuit configurations, enhancing the oscillator's flexibility.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this oscillator can withstand extended operation in harsh environments without performance degradation.

Minimum Operating Temperature: -55 °C

The wide operating temperature range from -55°C to 125°C ensures reliable performance in a variety of temperature conditions, providing versatility for different applications.

Mounting Feature: THROUGH HOLE MOUNT

The through-hole mounting feature simplifies the installation process and ensures secure mechanical connections, making it easier to integrate the oscillator into circuit boards.

Technical Specifications

Other Function Oscillators SNC54LS325J attributes and parameters. Explore more Other Function Oscillators devices from Texas Instruments

Specs

Mounting Feature:

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Equivalence Code:

DIP16,.3

Power Supplies (V):

5

Qualification:

Not Qualified

Screening Level:

MIL-STD-883 Class B (Modified)

Sub-Category:

Other Oscillators

Nominal Supply Voltage:

5 V

Technology:

TTL

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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