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SNC54LS327J

Texas Instruments

SNC54LS327J by Texas Instruments

SNC54LS327J by Texas Instruments is a TTL technology oscillator with 14 terminals and a 5V supply voltage. It operates b/w -55°C to 125°C, making it suitable for industrial applications. Packaged in ceramic, it meets MIL-STD-883 Class B standards for reliability.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,572 parts In-Stock

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6,572

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Digiode

USA . 1,805 parts In-Stock

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1,805

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Distributors (Availability)

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Parana Technologies

USA . 1,021 parts In-Stock

1+ parts

$0.866

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-

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$1.813

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1,021

$0.866

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$1.813

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DigiPath Technology Company

USA . 1,495 parts In-Stock

1+ parts

$0.954

100+ parts

$0.877

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-

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1,495

$0.954

$0.877

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ChromeModa Solutions

Germany . 3,489 parts In-Stock

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$0.973

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$0.798

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3,489

$0.973

$0.798

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IDEA Electronic Components Group

UK . 857 parts In-Stock

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$0.973

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$0.876

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857

$0.973

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$0.876

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Ampacity Inc.

Singapore . 341 parts In-Stock

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$2.010

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341

$2.010

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Semicontronic

India . 1,307 parts In-Stock

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$4.010

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$3.910

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$3.890

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1,307

$4.010

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$3.890

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One Stop Electronics

USA . 241 parts In-Stock

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$5.010

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241

$5.010

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AZTECH Wire

Italy . 636 parts In-Stock

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$7.078

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636

$7.078

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Corphita

USA . 4,567 parts In-Stock

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Corohmni

South Africa . 345 parts In-Stock

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Overview

Unlock the power of precision with the SNC54LS327J by Texas Instruments. Crafted with top-notch quality and cutting-edge technology, this product is designed to deliver unmatched performance in a variety of applications. From industrial automation to telecommunications, this TTL technology-based oscillator ensures reliable operation with a nominal supply voltage of 5V. With its MIL-STD-883 Class B screening level and ceramic package body material, you can trust in the durability and efficiency of this product. Experience the value and benefits that the SNC54LS327J brings to your projects today.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic packages are known for their durability and ability to withstand high temperatures, making them suitable for various environments and applications.

Screening Level: MIL-STD-883 Class B (Modified)

This screening level ensures that the product meets rigorous military standards for reliability and quality, offering high performance and reliability in demanding conditions.

Technology: TTL

TTL technology is known for its high speed and low power consumption, making this product ideal for applications requiring fast signal processing and efficient energy usage.

Nominal Supply Voltage: 5 V

The 5V supply voltage allows for compatibility with a wide range of systems and devices, making integration and operation convenient and versatile.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, this product can function reliably in high-temperature environments without risk of overheating or performance degradation.

Minimum Operating Temperature: -55 °C

The minimum operating temperature of -55°C ensures that this product can perform effectively even in extremely cold conditions, making it suitable for diverse operating environments.

Mounting Feature: THROUGH HOLE MOUNT

The through-hole mounting feature simplifies the installation process and provides secure mounting for the product, ensuring stability and reliability in various applications.

Technical Specifications

Other Function Oscillators SNC54LS327J attributes and parameters. Explore more Other Function Oscillators devices from Texas Instruments

Specs

Mounting Feature:

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Equivalence Code:

DIP14,.3

Power Supplies (V):

5

Qualification:

Not Qualified

Screening Level:

MIL-STD-883 Class B (Modified)

Sub-Category:

Other Oscillators

Nominal Supply Voltage:

5 V

Technology:

TTL

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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