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SN75LVDS9638DGKR

Texas Instruments

SN75LVDS9638DGKR by Texas Instruments

SN75LVDS9638DGKR by Texas Instruments is a Line Driver & Receiver with 3.6V max supply voltage, 6ns max transmit delay, and 0ns max receive delay. It is used in EIA-644/TIA-644 interface standard applications requiring CMOS technology for differential output communication.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,667 parts In-Stock

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3,667

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Chip Stock

USA . 3,006 parts In-Stock

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3,006

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Digiode

USA . 1,856 parts In-Stock

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1,856

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Distributors (Availability)

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Parana Technologies

USA . 260 parts In-Stock

1+ parts

$4.779

100+ parts

$443.830

1k+ parts

$4.301

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260

$4.779

$443.830

$4.301

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DigiPath Technology Company

USA . 1,129 parts In-Stock

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$5.263

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$5.263

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ChromeModa Solutions

Germany . 5,418 parts In-Stock

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$5.370

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$4.403

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$5.370

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IDEA Electronic Components Group

UK . 1,444 parts In-Stock

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$5.370

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$4.833

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$5.370

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$4.833

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AZTECH Wire

Italy . 605 parts In-Stock

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$14.090

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605

$14.090

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One Stop Electronics

USA . 1,413 parts In-Stock

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$17.500

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$17.500

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Component Stockers USA

USA . 667 parts In-Stock

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$99.990

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667

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Kepictronics

USA . 36,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 22,421 parts In-Stock

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Lixinc

USA . 15,402 parts In-Stock

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Corphita

USA . 1,162 parts In-Stock

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Microchip USA

USA . 159 parts In-Stock

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Overview

Enhance your electronic designs with the SN75LVDS9638DGKR by Texas Instruments, a top-tier manufacturer known for producing cutting-edge technology. As part of the Line Drivers & Receivers category, this product offers superior quality and reliability. With a maximum supply voltage of 3.6V and a small outline package style, it is perfect for various applications. Experience the benefits of its efficient power supplies, minimal transmit delay, and high-level input current. Elevate your projects with the unmatched value and performance that this innovative product provides.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and ensures the product is resistant to external elements, making it suitable for a variety of environments.

Maximum Supply Voltage: 3.6 V

Allows for compatibility with a wide range of systems and power supplies.

Maximum Transmit Delay: 6 ns

Ensures fast and efficient data transmission, making it ideal for high-speed applications.

Power Supplies (V): 3.3

Optimal voltage for reliable performance and compatibility with standard power sources.

Maximum Operating Temperature: 70 °C

Withstands higher temperatures, making it suitable for use in various industrial and commercial settings.

Technology: CMOS

Utilizes CMOS technology for low power consumption and efficient signal processing, enhancing overall performance.

Interface Standard: EIA-644; TIA-644

Complies with industry standards, ensuring interoperability with a wide range of devices and systems.

Technical Specifications

Line Drivers & Receivers SN75LVDS9638DGKR attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

2

Maximum High Level Input Current:

.00002 Amp

Input Characteristics:

STANDARD

Interface IC Type:

Interface Standard:

EIA-644; TIA-644

JESD-30 Code:

S-PDSO-G8

Length:

3 mm

No. of Functions:

2

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Minimum Out Swing:

.247 V

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Maximum Seated Height:

1.07 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Maximum Transmit Delay:

6 ns

Width:

3 mm

Trade Compliance

SN75LVDS9638DGKR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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