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SN74LVC2G80DCTRG4

Texas Instruments

SN74LVC2G80DCTRG4 by Texas Instruments

SN74LVC2G80DCTRG4 by Texas Instruments is a dual-function latch with 5.2ns propagation delay, suitable for automotive applications. It operates at 1.8V nominal voltage and supports a max frequency of 160MHz, making it ideal for high-speed circuit designs requiring low power consumption. With a compact package style and surface-mount capability, this CMOS technology-based component offers versatile integration options in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,444 parts In-Stock

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Digiode

USA . 1,878 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 236 parts In-Stock

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$7.923

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One Stop Electronics

USA . 1,601 parts In-Stock

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Parana Technologies

USA . 1,048 parts In-Stock

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$14.984

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DigiPath Technology Company

USA . 357 parts In-Stock

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$16.017

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357

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ChromeModa Solutions

Germany . 6,474 parts In-Stock

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$16.344

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$13.402

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IDEA Electronic Components Group

UK . 277 parts In-Stock

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$16.344

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$15.527

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$14.710

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Perfect Parts

USA . 3,134 parts In-Stock

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Microchip USA

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Corphita

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Overview

Unlock the door to seamless operation with the Texas Instruments SN74LVC2G80DCTRG4 Latches & Flip-Flops. Crafted with precision and expertise, this product boasts superior quality and reliability. Ideal for a wide range of applications, this component offers rapid response times and efficient performance. Experience the value and benefits of this innovative solution, designed to elevate your project to new heights. Choose Texas Instruments for cutting-edge technology that delivers unparalleled advantages.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this latch & flip-flop lightweight and durable, perfect for a variety of applications.

Propagation Delay At Nominal Supply: 5.2 ns

With a low propagation delay, this latch & flip-flop ensures fast operation and response times in the circuit.

Surface Mount: YES

Being surface mountable makes this latch & flip-flop easy to install and saves space on the PCB, making it efficient for compact designs.

No. of Functions: 2

Having 2 functions in a single component increases the functionality and versatility of this latch & flip-flop, providing more options for circuit design.

Nominal Supply Voltage / Vsup (V): 1.8

With a low nominal supply voltage, this latch & flip-flop is energy efficient and suitable for low power applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures the reliability and stability of this latch & flip-flop even in harsh environments.

Technology: CMOS

The use of CMOS technology ensures low power consumption and high noise immunity, making this latch & flip-flop a reliable choice for sensitive circuits.

Maximum Frequency At Nominal Supply: 160000000 Hz

With a high maximum frequency, this latch & flip-flop supports high-speed operation in the circuit, making it suitable for demanding applications.

Technical Specifications

Latches & Flip-Flops SN74LVC2G80DCTRG4 attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

2.95 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

160000000 Hz

Maximum I (ol):

32 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

2

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP8,.16

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.005 mA

Propagation Delay At Nominal Supply:

5.2 ns

Propagation Delay (tpd):

13.9 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.3 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

POSITIVE EDGE

Width:

2.8 mm

Minimum fmax:

160 MHz

Trade Compliance

SN74LVC2G80DCTRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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