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SN74LV4066ARGYRG4

Texas Instruments

SN74LV4066ARGYRG4 by Texas Instruments

SN74LV4066ARGYRG4 by Texas Instruments is a CMOS SPST switch with 4 channels, 180 ohm Ron, and 40 dB isolation. It operates at -40 to 85 °C and has a bandwidth of 50 kHz. Ideal for industrial applications requiring fast switching and low on-state resistance.

Median Price

$4.219

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 57 parts In-Stock

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$4.219

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Connector Distribution Corp

USA . 8,995 parts In-Stock

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8,995

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Right Parts Inc.

USA . 8,995 parts In-Stock

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8,995

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Vyrian

USA . 8,047 parts In-Stock

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Digiode

USA . 3,945 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Stockers USA

USA . 11,559 parts In-Stock

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$2.920

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One Stop Electronics

USA . 677 parts In-Stock

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$3.500

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Parana Technologies

USA . 579 parts In-Stock

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$6.152

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$6.921

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579

$6.152

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$6.921

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IDEA Electronic Components Group

UK . 2,213 parts In-Stock

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$6.912

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$6.221

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2,213

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ChromeModa Solutions

Germany . 1,912 parts In-Stock

1+ parts

$6.912

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$5.668

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AZTECH Wire

Italy . 588 parts In-Stock

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$9.574

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Microchip USA

USA . 2,297 parts In-Stock

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DigiPath Technology Company

USA . 1,042 parts In-Stock

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$6.232

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Corphita

USA . 302 parts In-Stock

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Overview

Experience unparalleled quality and reliability with the SN74LV4066ARGYRG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch Multiplexers & Switches that are perfect for a wide range of applications. With a focus on value and customer satisfaction, this product offers seamless functionality, efficient performance, and versatile capabilities. Trust Texas Instruments to provide you with the best-in-class solutions for all your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the internal components of the multiplexer, making it suitable for rugged environments.

No. of Functions: 4

Having 4 functions allows for versatile connectivity options, making the multiplexer suitable for various applications.

Nominal Supply Voltage (Vsup): 2.3 V

Operates at a low nominal supply voltage, making it energy-efficient and ideal for battery-operated devices.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the multiplexer can function reliably even in harsh environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the performance of the multiplexer.

Technical Specifications

Multiplexers & Switches SN74LV4066ARGYRG4 attributes and parameters. Explore more Multiplexers & Switches devices from Texas Instruments

Specs

Other IC type:

Nominal Bandwidth:

50 kHz

Maximum Input Voltage:

5.5 V

Minimum Input Voltage:

2 V

JESD-30 Code:

S-PQCC-N14

JESD-609 Code:

e4

Length:

3.5 mm

Moisture Sensitivity Level (MSL):

2

Normal Position (V):

NO

No. of Channels:

4

No. of Functions:

4

No. of Terminals:

14

Nominal Off-state Isolation:

40 dB

Nominal On-state Resistance Match:

6 ohm

Maximum On-state Resistance (Ron):

180 ohm

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output (V):

SEPARATE OUTPUT

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC14/18,.14SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/5

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Multiplexer or Switches

Maximum Supply Current (Isup):

.035 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage (Vsup):

2.3 V

Surface Mount:

YES

Maximum Switch-off Time:

25 ns

Maximum Switch-on Time:

25 ns

Switching (V):

MAKE-BEFORE-BREAK

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.5 mm

Trade Compliance

SN74LV4066ARGYRG4 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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