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SN74LS375NSRE4

Texas Instruments

SN74LS375NSRE4 by Texas Instruments

SN74LS375NSRE4 by Texas Instruments is a TTL latch with 2 bits, 27 ns propagation delay, and 5V supply voltage. It features positive edge trigger and complementary output polarity. Ideal for applications requiring fast data storage and retrieval in commercial temperature environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,582 parts In-Stock

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7,582

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Digiode

USA . 1,020 parts In-Stock

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1,020

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 347 parts In-Stock

1+ parts

$16.229

100+ parts

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347

$16.229

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Parana Technologies

USA . 2,158 parts In-Stock

1+ parts

$27.087

100+ parts

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$32.108

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2,158

$27.087

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$32.108

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DigiPath Technology Company

USA . 991 parts In-Stock

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$29.826

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991

$29.826

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IDEA Electronic Components Group

UK . 2,138 parts In-Stock

1+ parts

$30.435

100+ parts

$28.913

1k+ parts

$27.392

10k+ parts

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2,138

$30.435

$28.913

$27.392

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ChromeModa Solutions

Germany . 481 parts In-Stock

1+ parts

$30.435

100+ parts

$24.957

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481

$30.435

$24.957

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One Stop Electronics

USA . 1,365 parts In-Stock

1+ parts

$63.000

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1,365

$63.000

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Corphita

USA . 4,918 parts In-Stock

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Microchip USA

USA . 251 parts In-Stock

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Overview

Experience unparalleled quality and reliability with the SN74LS375NSRE4 by Texas Instruments, a leading manufacturer in the industry. This versatile latches & flip-flops category product offers exceptional performance and precision, delivering unmatched value to customers seeking top-notch electronic components. From its innovative design to its wide range of applications, this product is a game-changer for any project requiring fast and efficient data storage solutions. Trust Texas Instruments for superior technology that guarantees optimal results every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials provide durability and protection for the internal components of the latch or flip-flop, ensuring a longer lifespan.

Propagation Delay At Nominal Supply: 27 ns

Fast propagation delay ensures quick response times, making this latch or flip-flop suitable for high-speed applications.

Surface Mount: YES

Surface mount capability allows for easy installation and integration onto circuit boards without the need for additional mounting hardware.

No. of Functions: 2

Having multiple functions in one component reduces overall board space and complexity in the circuit design.

Package Shape: RECTANGULAR

Rectangular shape provides compatibility with standard PCB designs and allows for easier placement on the board.

No. of Bits: 2

Two bits allow for more versatile data storage and processing capabilities.

Nominal Supply Voltage / Vsup (V): 5

Standard supply voltage ensures compatibility with common power sources.

Power Supplies (V): 5

Consistent supply voltage ensures stable operation of the latch or flip-flop.

No. of Terminals: 16

Having 16 terminals allows for various connections and inputs, increasing flexibility in circuit design.

Maximum I (ol): 8 Amp

High output current capability makes this latch or flip-flop suitable for driving external loads.

Propagation Delay (tpd): 30 ns

Fast propagation delay ensures quick response times in data processing and signal transmission.

Maximum Operating Temperature: 70 °C

Wide operating temperature range allows for reliable operation in various environmental conditions.

Trigger Type: POSITIVE EDGE

Positive edge triggering provides precise control over data input, enhancing the performance of the latch or flip-flop.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature ensures the latch or flip-flop can function in colder environments as well.

Terminal Position: DUAL

Dual terminal position allows for versatile placement on the circuit board, accommodating different layouts.

Maximum Seated Height: 2 mm

Low seated height minimizes space requirements and allows for compact PCB designs.

Width: 5.3 mm

Narrow width facilitates efficient use of board space and enables closer component placement.

Output Polarity: COMPLEMENTARY

Complementary output polarity simplifies circuit design and enhances signal integrity.

Minimum Supply Voltage (Vsup): 4.75 V

Low minimum supply voltage ensures the latch or flip-flop can operate even when power supply is slightly below the nominal voltage.

Length: 10.2 mm

Moderate length allows for easy integration into standard PCB layouts without occupying excessive space.

Temperature Grade: COMMERCIAL

Commercial temperature grade indicates the latch or flip-flop is suitable for standard industrial applications.

Technology: TTL

TTL technology offers reliable and efficient digital signal processing capabilities for the latch or flip-flop.

Terminal Form: GULL WING

Gull wing terminal form simplifies surface mount installation process and ensures secure connections.

Packing Method: TR

TR packing method provides convenient packaging for transportation and storage of multiple latch or flip-flop components.

Terminal Pitch: 1.27 mm

Standard terminal pitch allows for compatibility with common PCB layouts and ensures easy integration.

Maximum Supply Voltage (Vsup): 5.25 V

Having a maximum supply voltage slightly above the nominal value enhances the latch or flip-flop's tolerance to voltage fluctuations.

Maximum Power Supply Current (ICC): 12 mA

Low power supply current requirement maximizes energy efficiency and reduces heat generation during operation.

Technical Specifications

Latches & Flip-Flops SN74LS375NSRE4 attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Additional Features:

DUMMY VAL

Family:

LS

JESD-30 Code:

R-PDSO-G16

Length:

10.2 mm

Logic IC Type:

Maximum I (ol):

8 Amp

No. of Bits:

2

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

12 mA

Propagation Delay At Nominal Supply:

27 ns

Propagation Delay (tpd):

30 ns

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

POSITIVE EDGE

Width:

5.3 mm

Trade Compliance

SN74LS375NSRE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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