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SN74LS173ANSRG4

Texas Instruments

SN74LS173ANSRG4 by Texas Instruments

SN74LS173ANSRG4 by Texas Instruments is a 4-bit latch with 3-STATE output, operating at 5V. It has a propagation delay of 35ns and max frequency of 25MHz. Ideal for applications requiring positive edge triggering in commercial temperature range.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,224 parts In-Stock

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Digiode

USA . 2,162 parts In-Stock

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2,162

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Distributors (Availability)

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AZTECH Wire

Italy . 800 parts In-Stock

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$12.437

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800

$12.437

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One Stop Electronics

USA . 1,461 parts In-Stock

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$21.000

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$21.000

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Parana Technologies

USA . 249 parts In-Stock

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$25.199

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$25.843

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249

$25.199

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$25.843

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ChromeModa Solutions

Germany . 1,979 parts In-Stock

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$28.314

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$23.217

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1,979

$28.314

$23.217

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IDEA Electronic Components Group

UK . 1,625 parts In-Stock

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$28.314

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$26.898

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$25.483

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1,625

$28.314

$26.898

$25.483

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DigiPath Technology Company

USA . 555 parts In-Stock

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$25.528

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555

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$25.528

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Corphita

USA . 459 parts In-Stock

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Microchip USA

USA . 221 parts In-Stock

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Overview

Discover the innovative SN74LS173ANSRG4 by Texas Instruments, a high-quality latch flip-flop that promises reliability and efficiency. Manufactured by industry leader Texas Instruments, this product is perfect for various applications in the technology sector. With its advanced features and durable construction, this small outline package offers exceptional value and performance. Upgrade your projects with the SN74LS173ANSRG4 and experience seamless operation and superior results like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and resistance to environmental factors, making the latch reliable for long-term use.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards.

No. of Bits: 4

4 bits allow for a range of values to be stored and manipulated, suitable for various applications.

Nominal Supply Voltage / Vsup (V): 5

A nominal supply voltage of 5V ensures compatibility with standard power sources.

Minimum Operating Temperature: 0 °C

Operational in a wide temperature range, making it suitable for diverse environments.

Maximum Frequency At Nominal Supply: 25000000 Hz

High frequency capability allows for fast and efficient data processing.

Technical Specifications

Latches & Flip-Flops SN74LS173ANSRG4 attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

LS

JESD-30 Code:

R-PDSO-G16

Length:

10.2 mm

Logic IC Type:

Maximum Frequency At Nominal Supply:

25000000 Hz

Maximum I (ol):

24 Amp

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

24 mA

Propagation Delay (tpd):

35 ns

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

POSITIVE EDGE

Width:

5.3 mm

Minimum fmax:

30 MHz

Trade Compliance

SN74LS173ANSRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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