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SN74HCT74DRG4

Texas Instruments

SN74HCT74DRG4 by Texas Instruments

SN74HCT74DRG4 by Texas Instruments is a dual-function latch with 14 terminals, operating at 5V. It features a propagation delay of 35ns and can handle load capacitance up to 50pF. Ideal for industrial applications requiring positive edge triggering and complementary output polarity.

Median Price

$0.225

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 69,130 parts In-Stock

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Vyrian

USA . 4,286 parts In-Stock

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Component Sense

UK . 2,092 parts In-Stock

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Connector Distribution Corp

USA . 1,127 parts In-Stock

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Right Parts Inc.

USA . 1,127 parts In-Stock

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Semi Source

USA . 1,074 parts In-Stock

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Digiode

USA . 374 parts In-Stock

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Bristol Electronics

USA . 265 parts In-Stock

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$0.225

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$0.135

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Microfarads

USA . 256 parts In-Stock

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Nova Conductors

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Distributors (Availability)

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AZTECH Wire

Italy . 361 parts In-Stock

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$18.822

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Ampacity Inc.

Singapore . 1,075 parts In-Stock

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$24.000

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Parana Technologies

USA . 2,124 parts In-Stock

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DigiPath Technology Company

USA . 569 parts In-Stock

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ChromeModa Solutions

Germany . 3,390 parts In-Stock

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IDEA Electronic Components Group

UK . 1,124 parts In-Stock

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One Stop Electronics

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A-Z Elektronik GmbH

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Corphita

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Continental Prestige Electronics

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Microchip USA

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Kepictronics

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Overview

Unlock the power of cutting-edge technology with Texas Instruments' SN74HCT74DRG4 Latches & Flip-Flops. Designed for efficiency and reliability, this product offers seamless integration into a variety of industrial applications. With a focus on quality and performance, Texas Instruments delivers unmatched value to customers seeking top-of-the-line components. Elevate your projects with the precision and innovation of the SN74HCT74DRG4, setting new standards in the industry.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection for the internal components of the latch or flip-flop.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving space and simplifying production processes.

No. of Functions: 2

This product offers dual functionality, providing versatility and functionality in electronic circuits.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard voltage level, making it compatible with a wide range of electronic systems.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, making it suitable for industrial and automotive applications.

Propagation Delay (tpd): 35 ns

The low propagation delay ensures efficient performance and signal processing in time-sensitive applications.

Technology: CMOS

Utilizes CMOS technology for low power consumption and compatibility with various digital systems.

Technical Specifications

Latches & Flip-Flops SN74HCT74DRG4 attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

HCT

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

22000000 Hz

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

2

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay (tpd):

35 ns

Qualification:

Not Qualified

Screening Level:

MIL-PRF-38535

Maximum Seated Height:

1.75 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

3.9 mm

Minimum fmax:

24 MHz

Trade Compliance

SN74HCT74DRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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